双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

NXS0104

Dual supply translating transceiver; open drain; auto direction sensing

The NXS0104 is a 4-bit, dual supply translating transceiver with auto direction sensing, that enables bidirectional voltage level translation. It features two 4-bit input-output ports (An and Bn), one output enable input (OE) and two supply pins (VCC(A) and VCC(B)). VCC(A) can be supplied at any voltage between 1.65 V and 3.6 V and VCC(B) can be supplied at any voltage between 2.3 V and 5.5 V, making the device suitable for translating between any of the voltage nodes (1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins An and OE are referenced to VCC(A) and pins Bn are referenced to VCC(B). A LOW level at pin OE causes the outputs to assume a high-impedance OFF-state. This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range:

    • VCC(A): 1.65 V to 3.6 V and VCC(B): 2.3 V to 5.5 V

  • Maximum data rates:

    • Push-pull: 24 Mbps

  • IOFF circuitry provides partial Power-down mode operation

  • Inputs accept voltages up to 5.5 V

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2500 V for A port

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 15000 V for B port

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

    • IEC61000-4-2 contact discharge exceeds 8000 V for B port

  • Latch-up performance exceeds 100 mA per JESD 78B Class II

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Applications

  • Desktop PC

  • Handset

  • Smartphone

  • Tablet

参数类型

型号 VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name
NXS0104BQ 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 6.0 4 low -40~125 DHVQFN14
NXS0104GU12 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 6.0 4 low -40~125 XQFN12
NXS0104PW 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 6.0 4 low -40~125 TSSOP14
NXS0104UM 1.65 - 3.6 2.3 - 5.5 CMOS - 0.02 / 1.0 6.0 4 low -40~125 WLCSP12

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
NXS0104BQ NXS0104BQX
(935690692115)		 Active S0104 SOT762-1
DHVQFN14
(SOT762-1) 		SOT762-1 SOT762-1_115
NXS0104GU12 NXS0104GU12X
(935690693115)		 Active SOT1174-1
XQFN12
(SOT1174-1) 		SOT1174-1 SOT1174-1_115
NXS0104PW NXS0104PWJ
(935690691118)		 Active NXS0104 SOT402-1
TSSOP14
(SOT402-1) 		SOT402-1 SSOP-TSSOP-VSO-WAVE
SOT402-1_118
NXS0104UM NXS0104UMAZ
(935691108336)		 Active m4 SOT8019-1
WLCSP12
(SOT8019-1) 		SOT8019-1 SOT8019-1_336

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
NXS0104UM NXS0104UMZ
(935691108084)		 Withdrawn / End-of-life m4 SOT8019-1
WLCSP12
(SOT8019-1) 		SOT8019-1 暂无信息

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
NXS0104BQ NXS0104BQX NXS0104BQ rohs rhf rhf
NXS0104GU12 NXS0104GU12X NXS0104GU12 rohs rhf rhf
NXS0104PW NXS0104PWJ NXS0104PW rohs rhf rhf
NXS0104UM NXS0104UMAZ NXS0104UM rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
NXS0104UM NXS0104UMZ NXS0104UM rohs rhf rhf
品质及可靠性免责声明

文档 (15)

文件名称 标题 类型 日期
NXS0104 Dual supply translating transceiver; open drain; auto direction sensing Data sheet 2024-04-04
AN90032 Low temperature soldering, application study Application note 2022-02-22
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT1174-1 3D model for products with SOT1174-1 package Design support 2021-01-28
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
SOT8019-1 3D model for products with SOT8019-1 package Design support 2023-02-07
nxs0104 NXS0104 IBIS model IBIS model 2020-11-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN14_SOT762-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP14_SOT402-1_mk plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT762-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body Package information 2023-04-05
SOT1174-1 plastic, leadless extremely thin quad flat package; 12 terminals; 0.4 mm pitch; 2 mm x 1.7 mm x 0.5 mm body Package information 2024-04-11
SOT402-1 plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-07
SOT8019-1 wafer level chip-scale package, 12 bumps; 1.36 x 1.86 x 0.60 mm Package information 2022-02-11
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT762-1 3D model for products with SOT762-1 package Design support 2019-10-03
SOT1174-1 3D model for products with SOT1174-1 package Design support 2021-01-28
SOT402-1 3D model for products with SOT402-1 package Design support 2023-02-02
SOT8019-1 3D model for products with SOT8019-1 package Design support 2023-02-07
nxs0104 NXS0104 IBIS model IBIS model 2020-11-05

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