74HC157; 74HCT157
Quad 2-input multiplexer
The 74HC157; 74HCT157 is a quad 2-input multiplexer. The device features select (S) and enable E inputs. A HIGH on S selects data source 1, a LOW data source 0. A HIGH on E forces all the outputs (1Y to 4Y) LOW. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Features and benefits
Wide supply voltage range from 2.0 V to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
Input levels:
For 74HC157: CMOS level
For 74HCT157: TTL level
Non-inverting data path
ESD protection:
-
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|
| 74HC157BQ | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | DHVQFN16 |
| 74HC157D | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | SO16 |
| 74HC157PW | 2.0 - 6.0 | CMOS | ± 5.2 | 11 | low | -40~125 | TSSOP16 |
| 74HCT157BQ | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | DHVQFN16 |
| 74HCT157D | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | SO16 |
| 74HCT157PW | 4.5 - 5.5 | TTL | ± 4 | 13 | low | -40~125 | TSSOP16 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74HC157BQ | 74HC157BQ,115 (935294423115) |
Active | HC157 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HC157D | 74HC157D,653 (933713740653) |
Active | 74HC157D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暂无信息 |
| 74HC157PW | 74HC157PW,118 (935186880118) |
Active | HC157 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT157BQ | 74HCT157BQ,115 (935294424115) |
Active | HCT157 |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| 74HCT157D | 74HCT157D,653 (933713750653) |
Active | 74HCT157D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
暂无信息 |
| 74HCT157PW | 74HCT157PW,118 (935188540118) |
Active | HCT157 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74HC157D | 74HC157D,652 (933713740652) |
Withdrawn / End-of-life | 74HC157D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_652 |
| 74HC157DB | 74HC157DB,112 (935186870112) |
Obsolete | HC157 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
| 74HC157DB,118 (935186870118) |
Obsolete | HC157 | 暂无信息 | ||||
| 74HC157PW | 74HC157PW,112 (935186880112) |
Withdrawn / End-of-life | HC157 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
暂无信息 |
| 74HCT157D | 74HCT157D,652 (933713750652) |
Withdrawn / End-of-life | 74HCT157D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_652 |
| 74HCT157DB | 74HCT157DB,112 (935188560112) |
Obsolete | HCT157 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
| 74HCT157DB,118 (935188560118) |
Obsolete | HCT157 | 暂无信息 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC157BQ | 74HC157BQ,115 | 74HC157BQ |
|
|
| 74HC157D | 74HC157D,653 | 74HC157D |
|
|
| 74HC157PW | 74HC157PW,118 | 74HC157PW |
|
|
| 74HCT157BQ | 74HCT157BQ,115 | 74HCT157BQ |
|
|
| 74HCT157D | 74HCT157D,653 | 74HCT157D |
|
|
| 74HCT157PW | 74HCT157PW,118 | 74HCT157PW |
|
|
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC157D | 74HC157D,652 | 74HC157D |
|
|
| 74HC157DB | 74HC157DB,112 | 74HC157DB |
|
|
| 74HC157DB | 74HC157DB,118 | 74HC157DB |
|
|
| 74HC157PW | 74HC157PW,112 | 74HC157PW |
|
|
| 74HCT157D | 74HCT157D,652 | 74HCT157D |
|
|
| 74HCT157DB | 74HCT157DB,112 | 74HCT157DB |
|
|
| 74HCT157DB | 74HCT157DB,118 | 74HCT157DB |
|
|
文档 (22)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74HC_HCT157 | Quad 2-input multiplexer | Data sheet | 2024-05-28 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| hc157 | 74HC157 IBIS model | IBIS model | 2015-11-03 |
| hct157 | 74HCT157 IBIS model | IBIS model | 2015-11-03 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| hc157 | 74HC157 IBIS model | IBIS model | 2015-11-03 |
| hct157 | 74HCT157 IBIS model | IBIS model | 2015-11-03 |
Ordering, pricing & availability
样品
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