双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74ALVC573

Octal D-type transparent latch; 3-state

The 74ALVC573 is an 8-bit D-type transparent latch with 3-state outputs. The device features latch enable (LE) and output enable (OE) inputs. When LE is HIGH, data at the inputs enter the latches. In this condition the latches are transparent, a latch output will change each time its corresponding D-input changes. When LE is LOW the latches store the information that was present at the inputs a set-up time preceding the HIGH-to-LOW transition of LE. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the latches.

Schmitt trigger action on all inputs makes the device tolerant of slow rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.65 V to 3.6 V

  • CMOS low power dissipation

  • Overvoltage tolerant inputs to 3.6 V

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 250 mA per JESD78 Class II.A

  • Complies with JEDEC standards:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) Power dissipation considerations Tamb (°C) Package name
74ALVC573BQ 1.65 - 3.6 LVTTL ± 24 2.2 low -40~85 DHVQFN20
74ALVC573D 1.65 - 3.6 LVTTL ± 24 2.2 low -40~85 SO20
74ALVC573PW 1.65 - 3.6 LVTTL ± 24 2.2 low -40~85 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74ALVC573BQ 74ALVC573BQ,115
(935273687115)		 Active ALVC573 SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74ALVC573D 74ALVC573D,118
(935269737118)		 Active 74ALVC573D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74ALVC573PW 74ALVC573PW,118
(935269736118)		 Active ALVC573 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74ALVC573BQ 74ALVC573BQ,115 74ALVC573BQ rohs rhf rhf
74ALVC573D 74ALVC573D,118 74ALVC573D rohs rhf rhf
74ALVC573PW 74ALVC573PW,118 74ALVC573PW rohs rhf rhf
品质及可靠性免责声明

文档 (14)

文件名称 标题 类型 日期
74ALVC573 Octal D-type transparent latch; 3-state Data sheet 2023-07-11
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
alvc573 alvc573 IBIS model IBIS model 2013-04-08
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2022-06-20
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Package information 2022-06-21
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
alvc573 alvc573 IBIS model IBIS model 2013-04-08

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