参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74LV00BQ | 1.0 - 5.5 | TTL | ± 12 | 7.0 | 30 | 4 | low | -40~125 | DHVQFN14 |
74LV00D | 1.0 - 5.5 | TTL | ± 12 | 7.0 | 30 | 4 | low | -40~125 | SO14 |
74LV00PW | 1.0 - 5.5 | TTL | ± 12 | 7.0 | 30 | 4 | low | -40~125 | TSSOP14 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LV00BQ | 74LV00BQ,115 (935285559115) |
Active | LV00 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74LV00D | 74LV00D,118 (935063080118) |
Active | 74LV00D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74LV00PW | 74LV00PW,118 (935174100118) |
Active | LV00 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LV00DB | 74LV00DB,112 (935170130112) |
Obsolete | no package information | ||||
74LV00DB,118 (935170130118) |
Obsolete |
文档 (20)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LV00 | Quad 2-input NAND gate | Data sheet | 2024-01-22 |
mna212 | Block diagram: 74LVC132ABQ, 74LVC132AD, 74LVC132APW, 74AHC00BQ, 74AHC00D, 74AHC00PW, 74AHCT00BQ, 74AHCT00D, 74AHCT00PW, 74LV00BQ, 74LV00D, 74LV00DB, 74LV00N, 74LV00PW, 74LVC00ABQ, 74LVC00AD, 74LVC00ADB, 74LVC00APW | Block diagram | 2009-11-04 |
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lv00 | 74LV00 IBIS model | IBIS model | 2019-01-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
74LV00U_041 | 74LV00U/C4; Reel dry pack, SMD, 7" Q2/T3 No mark chip Orderable part number ending ,041 or Z Ordering code (12NC) ending 041 | Packing information | 2020-04-27 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
lv | lv Spice model | SPICE model | 2013-05-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lv00 | 74LV00 IBIS model | IBIS model | 2019-01-09 |
lv | lv Spice model | SPICE model | 2013-05-07 |