参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74AHC32BQ | 2.0 - 5.5 | CMOS | ± 8 | 3.5 | 60 | 4 | low | -40~125 | DHVQFN14 |
74AHC32D | 2.0 - 5.5 | CMOS | ± 8 | 3.5 | 60 | 4 | low | -40~125 | SO14 |
74AHC32PW | 2.0 - 5.5 | CMOS | ± 8 | 3.5 | 60 | 4 | low | -40~125 | TSSOP14 |
74AHCT32BQ | 4.5 - 5.5 | TTL | ± 8 | 5.0 | 60 | 4 | low | -40~125 | DHVQFN14 |
74AHCT32D | 4.5 - 5.5 | TTL | ± 8 | 5.0 | 60 | 4 | low | -40~125 | SO14 |
74AHCT32PW | 4.5 - 5.5 | TTL | ± 8 | 5.0 | 60 | 4 | low | -40~125 | TSSOP14 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AHC32BQ | 74AHC32BQ,115 (935276443115) |
Active | AHC32 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74AHC32D | 74AHC32D,118 (935262642118) |
Active | 74AHC32D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74AHC32PW | 74AHC32PW,118 (935262643118) |
Active | AHC32 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
74AHCT32BQ | 74AHCT32BQ,115 (935276454115) |
Active | AHT32 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74AHCT32D | 74AHCT32D,118 (935262640118) |
Active | 74AHCT32D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_118 |
74AHCT32PW | 74AHCT32PW,118 (935262641118) |
Active | AHCT32 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AHC32D | 74AHC32D,112 (935262642112) |
Withdrawn / End-of-life | 74AHC32D |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_112 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AHC32BQ | 74AHC32BQ,115 | 74AHC32BQ | ||
74AHC32D | 74AHC32D,118 | 74AHC32D | ||
74AHC32PW | 74AHC32PW,118 | 74AHC32PW | ||
74AHCT32BQ | 74AHCT32BQ,115 | 74AHCT32BQ | ||
74AHCT32D | 74AHCT32D,118 | 74AHCT32D | ||
74AHCT32PW | 74AHCT32PW,118 | 74AHCT32PW |
下表中的所有产品型号均已停产 。
品质及可靠性免责声明文档 (18)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AHC_AHCT32 | Quad 2-input OR gate | Data sheet | 2024-03-07 |
mna242 | Block diagram: 74AHC32BQ, 74AHC32D, 74AHC32PW, 74AHCT32BQ, 74AHCT32D, 74AHCT32PW, 74ALVC32BQ, 74ALVC32D, 74ALVC32PW, 74HC32BQ, 74HC32D, 74HC32DB, 74HC32N, 74HC32PW, 74HCT32BQ, 74HCT32D, 74HCT32DB, 74HCT32N, 74HCT32PW, 74LVC32ABQ, 74LVC32AD, 74LVC32ADB, 74LVC32APW | Block diagram | 2009-11-04 |
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
ahc32 | ahc32 IBIS model | IBIS model | 2013-04-08 |
ahct32 | ahct32 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
ahc32 | ahc32 IBIS model | IBIS model | 2013-04-08 |
ahct32 | ahct32 IBIS model | IBIS model | 2013-04-08 |
Ordering, pricing & availability
样品
作为 Nexperia 的客户,您可以通过我们的销售机构订购样品。
如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。