参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74AUP1G14GW-Q100 | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 1 | ultra low | -40~125 | TSSOP5 |
| 74AUP1G14GX4-Q100 | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 1 | ultra low | -40~125 | X2SON4 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AUP1G14GW-Q100 | 74AUP1G14GW-Q100H (935691564125) |
Active | pF |
TSSOP5 (SOT353-1) |
SOT353-1 |
WAVE_BG-BD-1
|
SOT353-1_125 |
| 74AUP1G14GX4-Q100 | 74AUP1G14GX4-Q100Z (935691177147) |
Active | pF |
X2SON4 (SOT1269-2) |
SOT1269-2 | SOT1269-2_147 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AUP1G14GW-Q100 | 74AUP1G14GW-Q100H | 74AUP1G14GW-Q100 |
|
|
| 74AUP1G14GX4-Q100 | 74AUP1G14GX4-Q100Z | 74AUP1G14GX4-Q100 |
|
|
文档 (15)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AUP1G14_Q100 | Low-power Schmitt trigger inverter | Data sheet | 2023-10-27 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
| SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
| aup1g14 | 74AUP1G14 IBIS model | IBIS model | 2018-05-25 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| TSSOP5_SOT353-1_mk | plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2018-07-25 |
| XSON4_SOT1269-2_mk | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Marcom graphics | 2019-02-04 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| SOT1269-2 | plastic, leadless thermal enhanced extremely thin outline package, no leads; 4 terminals; 0.4 mm pitch; 0.6 mm x 0.6 mm x 0.32 mm body | Package information | 2020-08-18 |
| 74AUP1G14GX4-Q100_Nexperia_Product_Reliability | 74AUP1G14GX4-Q100 Nexperia Product Reliability | Quality document | 2024-06-16 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT353-1 | 3D model for products with SOT353-1 package | Design support | 2019-09-23 |
| SOT1269-2 | 3D model for products with SOT1269-2 package | Design support | 2023-02-02 |
| SOT1269 | 3D model for products with SOT1269 package | Design support | 2019-10-07 |
| aup1g14 | 74AUP1G14 IBIS model | IBIS model | 2018-05-25 |
Ordering, pricing & availability
样品
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