参数类型
| 型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|
| 74HC365D-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 6 | low | -40~125 | SO16 |
| 74HC365PW-Q100 | 2.0 - 6.0 | CMOS | ± 7.8 | 36 | 6 | low | -40~125 | TSSOP16 |
| 74HCT365D-Q100 | 4.5 - 5.5 | TTL | ± 6 | 36 | 6 | low | -40~125 | SO16 |
| 74HCT365PW-Q100 | 4.5 - 5.5 | TTL | ± 6 | 36 | 6 | low | -40~125 | TSSOP16 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74HC365D-Q100 | 74HC365D-Q100,118 (935298925118) |
Active | 74HC365D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HC365PW-Q100 | 74HC365PW-Q100,118 (935298926118) |
Active | HC365 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
| 74HCT365D-Q100 | 74HCT365D-Q100,118 (935298927118) |
Active | 74HCT365D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| 74HCT365PW-Q100 | 74HCT365PW-Q100,11 (935298928118) |
Active | HCT365 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74HC365D-Q100 | 74HC365D-Q100,118 | 74HC365D-Q100 |
|
|
| 74HC365PW-Q100 | 74HC365PW-Q100,118 | 74HC365PW-Q100 |
|
|
| 74HCT365D-Q100 | 74HCT365D-Q100,118 | 74HCT365D-Q100 |
|
|
| 74HCT365PW-Q100 | 74HCT365PW-Q100,11 | 74HCT365PW-Q100 |
|
|
文档 (17)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74HC_HCT365_Q100 | Hex buffer/line driver; 3-state | Data sheet | 2024-03-13 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| hc365 | 74HC365 IBIS Model | IBIS model | 2023-04-06 |
| hct365 | 74HCT365 IBIS Model | IBIS model | 2023-04-11 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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