参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|
74AHC139D-Q100 | 2.0 - 5.5 | CMOS | ± 8 | 3.9 | low | -40~125 | SO16 |
74AHC139PW-Q100 | 2.0 - 5.5 | CMOS | ± 8 | 3.9 | low | -40~125 | TSSOP16 |
74AHCT139D-Q100 | 4.5 - 5.5 | TTL | ± 8 | 3.6 | low | -40~125 | SO16 |
74AHCT139PW-Q100 | 4.5 - 5.5 | TTL | ± 8 | 3.6 | low | -40~125 | TSSOP16 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AHC139D-Q100 | 74AHC139D-Q100J (935300676118) |
Active | 74AHC139D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
74AHC139PW-Q100 | 74AHC139PW-Q100J (935300677118) |
Active | AHC139 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
74AHCT139D-Q100 | 74AHCT139D-Q100J (935300679118) |
Active | 74AHCT139D |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
74AHCT139PW-Q100 | 74AHCT139PW-Q100J (935300681118) |
Active | AHCT139 |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AHC139D-Q100 | 74AHC139D-Q100J | 74AHC139D-Q100 | ||
74AHC139PW-Q100 | 74AHC139PW-Q100J | 74AHC139PW-Q100 | ||
74AHCT139D-Q100 | 74AHCT139D-Q100J | 74AHCT139D-Q100 | ||
74AHCT139PW-Q100 | 74AHCT139PW-Q100J | 74AHCT139PW-Q100 |
文档 (14)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AHC_AHCT139_Q100 | Dual 2-to-4 line decoder/demultiplexer | Data sheet | 2024-02-29 |
SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
ahc139 | ahc139 IBIS model | IBIS model | 2013-04-08 |
ahct139 | ahct139 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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