双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74AUP1G18

Low-power 1-of-2 demultiplexer with 3-state deselected output

The 74AUP1G18 is a 1-to-2 demultiplexer with a 3-state outputs. The device buffers the data on input A and passes it to output 1Y or 2Y, depending on whether the state of the select input (S) is LOW or HIGH. The unused output assumes the high impedence OFF-state. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • CMOS low power dissipation

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • Overvoltage tolerant inputs to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) Power dissipation considerations Tamb (°C) Package name
74AUP1G18GM 0.8 - 3.6 CMOS 1.9 / -1.9 3.2 ultra low -40~125 XSON6
74AUP1G18GN 0.8 - 3.6 CMOS 1.9 / -1.9 3.2 ultra low -40~125 XSON6
74AUP1G18GS 0.8 - 3.6 CMOS 1.9 / -1.9 3.2 ultra low -40~125 XSON6
74AUP1G18GW 0.8 - 3.6 CMOS 1.9 / -1.9 3.2 ultra low -40~125 TSSOP6

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP1G18GM 74AUP1G18GM,115
(935279953115)		 Active pW SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74AUP1G18GM,132
(935279953132)		 Active pW SOT886_132
74AUP1G18GN 74AUP1G18GN,132
(935291731132)		 Active pW SOT1115
XSON6
(SOT1115) 		SOT1115 REFLOW_BG-BD-1
SOT1115_132
74AUP1G18GS 74AUP1G18GS,132
(935292855132)		 Active pW SOT1202
XSON6
(SOT1202) 		SOT1202 REFLOW_BG-BD-1
SOT1202_132
74AUP1G18GW 74AUP1G18GW,125
(935279952125)		 Active pW SOT363-2
TSSOP6
(SOT363-2) 		SOT363-2 SOT363-2_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP1G18GM 74AUP1G18GM,115 74AUP1G18GM rohs rhf rhf
74AUP1G18GM 74AUP1G18GM,132 74AUP1G18GM rohs rhf rhf
74AUP1G18GN 74AUP1G18GN,132 74AUP1G18GN rohs rhf rhf
74AUP1G18GS 74AUP1G18GS,132 74AUP1G18GS rohs rhf rhf
74AUP1G18GW 74AUP1G18GW,125 74AUP1G18GW rohs rhf rhf
品质及可靠性免责声明

文档 (24)

文件名称 标题 类型 日期
74AUP1G18 Low-power 1-of-2 demultiplexer with 3-state deselected output Data sheet 2023-07-17
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11052 Pin FMEA for AUP family Application note 2019-01-09
mnb088 Block diagram: 74AUP1G18GF, 74AUP1G18GM, 74AUP1G18GW, 74LVC1G18GV, 74LVC1G18GW Block diagram 2009-11-03
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
aup1g18 aup1g18 IBIS model IBIS model 2014-12-21
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
aup1g18 aup1g18 IBIS model IBIS model 2014-12-21

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