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74AVC1T45
Dual-supply voltage level translator/transceiver; 3-state
The 74AVC1T45 is a single bit, dual supply transceiver with 3-state output that enables bidirectional level translation. It features two 1-bit input-output ports (A and B), a direction control input (DIR) and dual supply pins (VCC(A) and VCC(B)). Both VCC(A) and VCC(B) can be supplied at any voltage between 0.8 V and 3.6 V making the device suitable for translating between any of the low voltage nodes (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V). Pins A and DIR are referenced to VCC(A) and pin B is referenced to VCC(B). A HIGH on DIR allows transmission from A to B and a LOW on DIR allows transmission from B to A.
The device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down. In suspend mode when either VCC(A) or VCC(B) are at GND level, both A and B are in the high-impedance OFF-state.
Features and benefits
Wide supply voltage range:
VCC(A): 0.8 V to 3.6 V
VCC(B): 0.8 V to 3.6 V
High noise immunity
CMOS low power dissipation
Suspend mode
Latch-up performance exceeds 100 mA per JESD 78 Class II
Overvoltage tolerant inputs to 3.6 V
Dynamically controlled outputs
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Maximum data rates:
500 Mbit/s (1.8 V to 3.3 V translation)
320 Mbit/s (< 1.8 V to 3.3 V translation)
320 Mbit/s (translate to 2.5 V or 1.8 V)
280 Mbit/s (translate to 1.5 V)
240 Mbit/s (translate to 1.2 V)
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74AVC1T45GM | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
74AVC1T45GM-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
74AVC1T45GN | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
74AVC1T45GS | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
74AVC1T45GS-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
74AVC1T45GW | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | TSSOP6 |
74AVC1T45GW-Q100 | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | TSSOP6 |
74AVC1T45GX | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | X2SON6 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AVC1T45GM | 74AVC1T45GM,115 (935284154115) |
Active | B5 |
![]() XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
74AVC1T45GM,132 (935284154132) |
Active | B5 | SOT886_132 | ||||
74AVC1T45GM-Q100 | 74AVC1T45GM-Q100H (935299489125) |
Active | B5 |
![]() XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_125 |
74AVC1T45GN | 74AVC1T45GN,132 (935294359132) |
Active | B5 |
![]() XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
74AVC1T45GS | 74AVC1T45GS,132 (935294361132) |
Active | B5 |
![]() XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
74AVC1T45GS-Q100 | 74AVC1T45GS-Q100H (935690771125) |
Active | B5 |
![]() XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
暂无信息 |
74AVC1T45GW | 74AVC1T45GW,125 (935284153125) |
Active | B5 |
![]() TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
74AVC1T45GW-Q100 | 74AVC1T45GW-Q100H (935299491125) |
Active | B5 |
![]() TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 | |
74AVC1T45GX | 74AVC1T45GXZ (935308468147) |
Active | B5 |
![]() X2SON6 (SOT1255-2) |
SOT1255-2 | SOT1255-2_147 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AVC1T45GM | 74AVC1T45GM,115 | 74AVC1T45GM |
|
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74AVC1T45GM | 74AVC1T45GM,132 | 74AVC1T45GM |
|
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74AVC1T45GM-Q100 | 74AVC1T45GM-Q100H | 74AVC1T45GM-Q100 |
|
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74AVC1T45GN | 74AVC1T45GN,132 | 74AVC1T45GN |
|
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74AVC1T45GS | 74AVC1T45GS,132 | 74AVC1T45GS |
|
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74AVC1T45GS-Q100 | 74AVC1T45GS-Q100H | 74AVC1T45GS-Q100 |
|
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74AVC1T45GW | 74AVC1T45GW,125 | 74AVC1T45GW |
|
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74AVC1T45GW-Q100 | 74AVC1T45GW-Q100H | 74AVC1T45GW-Q100 |
|
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74AVC1T45GX | 74AVC1T45GXZ | 74AVC1T45GX |
|
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文档 (26)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AVC1T45 | Dual-supply voltage level translator/transceiver; 3-state | Data sheet | 2024-07-02 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
001aag886 | Block diagram: 74AVC1T45GM, 74AVC1T45GW, 74AVCH1T45GM, 74AVCH1T45GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
avc1t45 | 74AVC1T45 IBIS model | IBIS model | 2016-02-24 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
SOT1255-2 | plastic thermal enhanced extremely thin small outline package; no leads;6 terminals; body 1.0 x 0.8 x 0.32 mm | Package information | 2020-08-27 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
SOT1255-2 | 3D model for products with SOT1255-2 package | Design support | 2021-01-28 |
avc1t45 | 74AVC1T45 IBIS model | IBIS model | 2016-02-24 |
Ordering, pricing & availability
样品
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