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74AVCH1T45
Dual-supply voltage level translator/transceiver; 3-state
The 74AVCH1T45 is a single bit, dual supply transceiver that enables bidirectional level translation. The 74AVCH1T45 has active bus hold circuitry which is provided to hold unused or floating data inputs at a valid logic level. This feature eliminates the need for external pull-up or pull-down resistors.The device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing potentially damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
CMOS low power dissipation
Overvoltage tolerant inputs to 3.6 V
Dynamically controlled outpus
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.65 V to 1.95 V)
JESD8-5 (2.3 V to 2.7 V)
JESD8C (2.7 V to 3.6 V)
Maximum data rates:
500 Mbit/s (1.8 V to 3.3 V translation)
320 Mbit/s (< 1.8 V to 3.3 V translation)
320 Mbit/s (translate to 2.5 V or 1.8 V)
280 Mbit/s (translate to 1.5 V)
240 Mbit/s (translate to 1.2 V)
Suspend mode
Bus hold on data inputs
Latch-up performance exceeds 100 mA per JESD 78 Class II
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 3B exceeds 8000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C
参数类型
型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|---|
74AVCH1T45GM | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
74AVCH1T45GN | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
74AVCH1T45GS | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | XSON6 |
74AVCH1T45GW | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 2.1 | 1 | very low | -40~125 | TSSOP6 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AVCH1T45GM | 74AVCH1T45GM,115 (935284155115) |
Active | K5 |
![]() XSON6 (SOT886) |
SOT886 |
REFLOW_BG-BD-1
|
SOT886_115 |
74AVCH1T45GM,132 (935284155132) |
Active | K5 | SOT886_132 | ||||
74AVCH1T45GN | 74AVCH1T45GN,132 (935294362132) |
Active | K5 |
![]() XSON6 (SOT1115) |
SOT1115 |
REFLOW_BG-BD-1
|
SOT1115_132 |
74AVCH1T45GS | 74AVCH1T45GS,132 (935294363132) |
Active | K5 |
![]() XSON6 (SOT1202) |
SOT1202 |
REFLOW_BG-BD-1
|
SOT1202_132 |
74AVCH1T45GW | 74AVCH1T45GW,125 (935284156125) |
Active | K5 |
![]() TSSOP6 (SOT363-2) |
SOT363-2 | SOT363-2_125 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AVCH1T45GM | 74AVCH1T45GM,115 | 74AVCH1T45GM |
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74AVCH1T45GM | 74AVCH1T45GM,132 | 74AVCH1T45GM |
|
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74AVCH1T45GN | 74AVCH1T45GN,132 | 74AVCH1T45GN |
|
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74AVCH1T45GS | 74AVCH1T45GS,132 | 74AVCH1T45GS |
|
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74AVCH1T45GW | 74AVCH1T45GW,125 | 74AVCH1T45GW |
|
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文档 (23)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AVCH1T45 | Dual-supply voltage level translator/transceiver; 3-state | Data sheet | 2024-07-02 |
AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
001aag886 | Block diagram: 74AVC1T45GM, 74AVC1T45GW, 74AVCH1T45GM, 74AVCH1T45GW | Block diagram | 2009-11-03 |
Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
avch1t45 | 74AVCH1T45 Ibis model | IBIS model | 2014-10-14 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN1410-6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT886_mk | plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
XSON6_SOT1115_mk | plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2022-06-01 |
SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2022-05-27 |
SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2022-06-01 |
SOT363-2 | plastic thin shrink small outline package; 6 leads; body width 1.25 mm | Package information | 2022-11-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT886 | 3D model for products with SOT886 package | Design support | 2019-10-03 |
SOT1115 | 3D model for products with SOT1115 package | Design support | 2023-02-02 |
SOT1202 | 3D model for products with SOT1202 package | Design support | 2023-02-02 |
SOT363-2 | 3D model for products with SOT363-2 package | Design support | 2023-02-02 |
avch1t45 | 74AVCH1T45 Ibis model | IBIS model | 2014-10-14 |
Ordering, pricing & availability
样品
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