双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)
SOT1061D

DFN2020D_3_SERIES

Applications

Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an integrated guard ring for stress protection, encapsulated in an ultra-thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.

Features and benefits

  • Average forward current up to IF(AV) ≤ 2 A
  • Reverse voltage VR ≤ 20 , 30, 40 and 60 V
  • Low forward voltage
  • Low reverse current
  • Reduced Printed-Circuit-Board (PCB) area requirements
  • Exposed heat sink (cathode pad) for excellent thermal and electrical conductivity
  • Leadless small SMD plastic package with visible and solderable side pads
  • Suitable for Automatic Optical Inspection (AOI) of solder joints
  • AEC-Q101 qualified

Applications

  • Low voltage rectification
  • High efficiency DC-to-DC conversion
  • Switch Mode Power Supply (SMPS)
  • Free-wheeling application
  • Reverse polarity protection
  • Low power consumption application
  • Battery chargers for mobile equipment
  • LED backlight for mobile application

参数类型

型号 Package version Package name Size (mm) VR [max] (V) IF [max] (A) Nr of functions Configuration IR [max] (µA) Cd [max] (pF) Remark
PMEG2010EPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 20 1 single single 1900 175 solderable side pads
PMEG2020CPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 20 2 dual common cathode 385 420 380 1000 175 solderable side pads N
PMEG2020EPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 20 2 single single 385 420 335 1900 175 solderable side pads N
PMEG3020CPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 30 2 dual common cathode 410 440 485 2000 170 solderable side pads N
PMEG3020EPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 30 2 single single 2500 150 solderable side pads
PMEG4010CPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 40 1 dual common cathode 440 500 12 55 130 solderable side pads N
PMEG4020EPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 40 2 single single 100 270 solderable side pads
PMEG6010CPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 60 1 dual common cathode 0.1@VR=60V 40@VR=10V 540@IF=1A solderable side pads
PMEG6020EPAS SOT1061D DFN2020D-3 2 x 2 x 0.65 60 2 single single 505 575 55 250 250 solderable side pads N

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
PMEG2010EPAS PMEG2010EPASX
(934068153115)		 Active CR SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
PMEG2020CPAS PMEG2020CPASX
(934068148115)		 Active CW SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
PMEG2020EPAS PMEG2020EPASX
(934068149115)		 Active CN SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
PMEG3020CPAS PMEG3020CPASX
(934068145115)		 Active CT SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
PMEG3020EPAS PMEG3020EPASX
(934068151115)		 Active CP SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
PMEG4010CPAS PMEG4010CPASX
(934068146115)		 Active CU SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
PMEG4020EPAS PMEG4020EPASX
(934068154115)		 Active CS SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
PMEG6010CPAS PMEG6010CPASX
(934068147115)		 Active CV SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115
PMEG6020EPAS PMEG6020EPASX
(934068152115)		 Active CQ SOT1061D
DFN2020D-3
(SOT1061D) 		SOT1061D REFLOW_BG-BD-1
SOT1061D_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PMEG2010EPAS PMEG2010EPASX PMEG2010EPAS rohs rhf rhf
PMEG2020CPAS PMEG2020CPASX PMEG2020CPAS rohs rhf rhf
PMEG2020EPAS PMEG2020EPASX PMEG2020EPAS rohs rhf rhf
PMEG3020CPAS PMEG3020CPASX PMEG3020CPAS rohs rhf rhf
PMEG3020EPAS PMEG3020EPASX PMEG3020EPAS rohs rhf rhf
PMEG4010CPAS PMEG4010CPASX PMEG4010CPAS rohs rhf rhf
PMEG4020EPAS PMEG4020EPASX PMEG4020EPAS rohs rhf rhf
PMEG6010CPAS PMEG6010CPASX PMEG6010CPAS rohs rhf rhf
PMEG6020EPAS PMEG6020EPASX PMEG6020EPAS rohs rhf rhf
品质及可靠性免责声明

文档 (10)

文件名称 标题 类型 日期
AN90023 Thermal performance of DFN packages Application note 2020-11-23
AN90023_ZH Thermal performance of DFN packages Application note 2021-02-26
Nexperia_asset_document_brochure_autoDFN_CN_LR 小巧轻便的汽车 二极管和晶体管 Brochure 2022-04-26
SOT1061D 3D model for products with SOT1061D package Design support 2021-07-30
Nexperia_AutoDFN_factsheet_2022 Small & light automotive diodes and transistors Leaflet 2022-04-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020D-3_SOT1061D_mk plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1061D plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-10-10
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10

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模型

文件名称 标题 类型 日期
SOT1061D 3D model for products with SOT1061D package Design support 2021-07-30

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