双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

LSF0102; LSF0202

2-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0102 and LSF0202 are both 2 channel bidirectional multi-voltage level translators for open-drain and push-pull applications. The LSF0102 and LSF0202 support up to 100 MHz up translation and ≥100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. Both support 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

LSF0102 and LSF0202 differ in pin assignment only.

Features and benefits

  • Bidirectional voltage translation with no direction pin

  • Up translation

    • ≤ 100 MHz; CL = 30 pF

    • ≤ 50 MHz; CL = 50 pF

  • Down translation

    • ≥ 100 MHz; CL = 30 pF

    • ≥ 50 MHz; CL = 50 pF

  • Hot insertion

  • Bidirectional voltage level translation between:

    • 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.8 V and 2.5 V, 3.3 V and 5.0 V

    • 2.5 V and 3.3 V and 5.0 V

    • 3.3 V and 5.0 V

  • Low standby current

  • 5 V tolerant I/O pins to support TTL

  • Low RON provides less signal distortion

  • High-impedance I/O pins for EN = Low

  • Both, LSF0102 and LSF0202 support flow-through pinout for easy PCB trace routing

  • Latch-up performance exceeds 100 mA per JESD78 class II level A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +125 °C

Applications

  • GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure

  • Industrial

  • Personal computing

参数类型

型号 VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name
LSF0102DC 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 2 low -40~125 VSSOP8
LSF0102DP 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 2 low -40~125 TSSOP8
LSF0102GS 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 2 low -40~125 XSON8
LSF0102GX 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 2 low -40~125 X2SON8
LSF0202GS 0.95 - 5.0 0.95 - 5.0 CMOS + 64 0.7 2 low -40~125 XSON8

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
LSF0102DC LSF0102DCH
(935690293125)		 Active h2 SOT765-1
VSSOP8
(SOT765-1) 		SOT765-1 SOT765-1_125
LSF0102DP LSF0102DPH
(935690955125)		 Active h2 SOT505-2
TSSOP8
(SOT505-2) 		SOT505-2 SOT505-2_125
LSF0102GS LSF0102GSX
(935691115115)		 Active h2 SOT1203
XSON8
(SOT1203) 		SOT1203 REFLOW_BG-BD-1
SOT1203_115
LSF0102GX LSF0102GXX
(935690294115)		 Active h2 SOT1233-2
X2SON8
(SOT1233-2) 		SOT1233-2 SOT1233-2_115
LSF0202DC LSF0202DCH
(935691833125)		 Samples available / Development h6 SOT765-1
VSSOP8
(SOT765-1) 		SOT765-1 SOT765-1_125
LSF0202GS LSF0202GSX
(935691832115)		 Active h6 SOT1203
XSON8
(SOT1203) 		SOT1203 REFLOW_BG-BD-1
SOT1203_115

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
LSF0102DC LSF0102DCH LSF0102DC rohs rhf rhf
LSF0102DP LSF0102DPH LSF0102DP rohs rhf rhf
LSF0102GS LSF0102GSX LSF0102GS rohs rhf rhf
LSF0102GX LSF0102GXX LSF0102GX rohs rhf rhf
LSF0202DC LSF0202DCH LSF0202DC rohs rhf rhf
LSF0202GS LSF0202GSX LSF0202GS rohs rhf rhf
品质及可靠性免责声明

文档 (18)

文件名称 标题 类型 日期
LSF0102_0202 2-bit bidirectional multi-voltage level translator; open-drain; push-pull Data sheet 2024-06-25
AN90050 Pin FMEA for LSF family Application note 2023-12-14
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT505-2 3D model for products with SOT505-2 package Design support 2019-01-18
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT1233-2 3D model for products with SOT1233-2 package Design support 2021-01-28
lsf0102 LSF0102 IBIS model IBIS model 2020-04-14
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
VSSOP8_SOT765-1_mk plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Marcom graphics 2017-01-28
XSON8_SOT1203_mk plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Marcom graphics 2019-02-04
SOT765-1 plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Package information 2022-06-03
SOT505-2 plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body Package information 2022-06-03
SOT1203 plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Package information 2022-06-03
SOT1233-2 plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm Package information 2022-04-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT1203 MAR_SOT1203 Topmark Top marking 2013-06-03

支持

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模型

文件名称 标题 类型 日期
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT505-2 3D model for products with SOT505-2 package Design support 2019-01-18
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT1233-2 3D model for products with SOT1233-2 package Design support 2021-01-28
lsf0102 LSF0102 IBIS model IBIS model 2020-04-14

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