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Click here for more informationPSMN1R1-60YSF
N-channel 60 V, 1.1 mOhm, standard level NextPower MOSFET in LFPAK56E
NextPower 60 V family utilizes RESURF (Reduced Surface Field) technology, combined with low Qrr and optimized body-diode for efficient switching and reduced spiking. This product has been designed and qualified for high-performance and rugged power switching applications.
Features and benefits
250 A continuous ID(max)
Avalanche rated, 100% tested
High reliability LFPAK (Power SO8) package, qualified to 175 °C
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LFPAK copper clip:
Improved thermal dissipation and even current distribution
Reduced electrical and thermal resistance
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LFPAK gull wing lead:
Enhanced wetting area for solder coverage and visual soldering inspection
High Board Level Reliability, absorbing thermal expansion and mechanical strain
Applications
eFuse
DC-to-DC converters
Motor drives
Battery management systems
Power supplies
Inverters
参数类型
型号 | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QG(tot) [typ] @ VGS = 10 V (nC) | VGSth [typ] (V) | Automotive qualified | Release date |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|
PSMN1R1-60YSF | SOT1023 | LFPAK56E; Power-SO8 | Development | N | 1 | 60 | 1.15 | 175 | 120 | 80 | 2.6 | N | 2024-06-12 |
文档 (7)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PSMN1R1-60YSF | N-channel 60 V, 1.1 mOhm, standard level NextPower MOSFET in LFPAK56E | Data sheet | 2024-06-17 |
AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
SOT1023 | 3D model for products with SOT1023 package | Design support | 2017-06-29 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
LFPAK56_SOT1023_mk | plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch; 4.58 mm x 5.13 mm x 1.03 mm body | Marcom graphics | 2017-01-28 |
SOT1023 | plastic, single-ended surface-mounted package (LFPAK56E); 4 leads; 1.27 mm pitch | Package information | 2024-02-06 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT1023 | 3D model for products with SOT1023 package | Design support | 2017-06-29 |
订购、定价与供货
样品
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如果您没有 Nexperia 的直接账户,我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.