参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
74AUP3G17DC | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | VSSOP8 |
74AUP3G17GN | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | XSON8 |
74AUP3G17GS | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | XSON8 |
74AUP3G17GT | 0.8 - 3.6 | CMOS | ± 1.9 | 70 | 3 | ultra low | -40~125 | XSON8 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AUP3G17DC | 74AUP3G17DCH (935280697125) |
Active | pV |
VSSOP8 (SOT765-1) |
SOT765-1 | SOT765-1_125 | |
74AUP3G17GN | 74AUP3G17GNX (935307192115) |
Active | pV |
XSON8 (SOT1116) |
SOT1116 |
REFLOW_BG-BD-1
|
SOT1116_115 |
74AUP3G17GS | 74AUP3G17GSX (935307193115) |
Active | pV |
XSON8 (SOT1203) |
SOT1203 |
REFLOW_BG-BD-1
|
SOT1203_115 |
74AUP3G17GT | 74AUP3G17GTX (935280696115) |
Active | pV |
XSON8 (SOT833-1) |
SOT833-1 | SOT833-1_115 |
环境信息
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74AUP3G17DC | 74AUP3G17DCH | 74AUP3G17DC | ||
74AUP3G17GN | 74AUP3G17GNX | 74AUP3G17GN | ||
74AUP3G17GS | 74AUP3G17GSX | 74AUP3G17GS | ||
74AUP3G17GT | 74AUP3G17GTX | 74AUP3G17GT |
文档 (20)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74AUP3G17 | Low-power triple Schmitt trigger | Data sheet | 2023-07-31 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
VSSOP8_SOT765-1_mk | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Marcom graphics | 2017-01-28 |
XSON8_SOT1203_mk | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Marcom graphics | 2019-02-04 |
SOT765-1 | plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body | Package information | 2022-06-03 |
SOT1116 | plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body | Package information | 2022-06-02 |
SOT1203 | plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body | Package information | 2022-06-03 |
SOT833-1 | plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body | Package information | 2022-06-03 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
MAR_SOT1116 | MAR_SOT1116 Topmark | Top marking | 2013-06-03 |
MAR_SOT1203 | MAR_SOT1203 Topmark | Top marking | 2013-06-03 |
MAR_SOT833 | MAR_SOT833 Topmark | Top marking | 2013-06-03 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT765-1 | 3D model for products with SOT765-1 package | Design support | 2020-01-22 |
SOT1116 | 3D model for products with SOT1116 package | Design support | 2023-02-02 |
SOT1203 | 3D model for products with SOT1203 package | Design support | 2023-02-02 |
SOT833-1 | 3D model for products with SOT833-1 package | Design support | 2021-01-28 |
Ordering, pricing & availability
样品
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