参数类型
| 型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|
| 74AVC1T1022DP | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 4.0 | 1 | very low | -40~125 | TSSOP10 | Uni-directional |
| 74AVC1T1022GU | 0.8 - 3.6 | 0.8 - 3.6 | CMOS/LVTTL | ± 12 | 4.0 | 1 | very low | -40~125 | XQFN10 | Uni-directional |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74AVC1T1022DP | 74AVC1T1022DPJ (935305831118) |
Active | B2 |
TSSOP10 (SOT552-1) |
SOT552-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT552-1_118 |
| 74AVC1T1022GU | 74AVC1T1022GUX (935305832115) |
Active | B2 |
XQFN10 (SOT1160-1) |
SOT1160-1 | SOT1160-1_115 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74AVC1T1022DP | 74AVC1T1022DPJ | 74AVC1T1022DP |
|
|
| 74AVC1T1022GU | 74AVC1T1022GUX | 74AVC1T1022GU |
|
|
文档 (14)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74AVC1T1022 | 1-to-4 fan-out buffer | Data sheet | 2024-06-25 |
| Nexperia_document_guide_Logic_translators | Nexperia Logic Translators | Brochure | 2021-04-12 |
| Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT552-1 | 3D model for products with SOT552-1 package | Design support | 2020-01-22 |
| SOT1160-1 | 3D model for products with SOT1160-1 package | Design support | 2019-10-03 |
| avc1t1022 | 74AVC1T1022 IBIS model | IBIS model | 2015-10-26 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| TSSOP10_SOT552_mk | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| XQFN10_SOT1160-1_mk | plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT552-1 | plastic, thin shrink small outline package; 10 leads; 0.5 mm pitch; 3 mm x 3 mm x 1.1 mm body | Package information | 2022-06-07 |
| SOT1160-1 | plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-07 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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