参数类型
| 型号 | VCC(A) (V) | VCC(B) (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | Nr of bits | Power dissipation considerations | Tamb (°C) | Package name | Category |
|---|---|---|---|---|---|---|---|---|---|---|
| NXT4557GU | 1.08 - 1.98 | 1.62 - 3.3 | CMOS | ± 1 | 20 | 3 | low | -40~85 | XQFN10 | Application specific |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| NXT4557GU | NXT4557GUX (935691191115) |
Active | z7 |
XQFN10 (SOT1160-1) |
SOT1160-1 | SOT1160-1_115 |
文档 (7)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| NXT4557 | SIM card interface level translator with enable pin | Data sheet | 2024-07-31 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| SOT1160-1 | 3D model for products with SOT1160-1 package | Design support | 2019-10-03 |
| nxt4557 | NXT4557 IBIS model | IBIS model | 2021-08-31 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| XQFN10_SOT1160-1_mk | plastic, extremely thin quad flat package; no leads; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Marcom graphics | 2017-01-28 |
| SOT1160-1 | plastic, leadless extremely thin quad flat package; 10 terminals; 0.4 mm pitch; 1.4 mm x 1.8 mm x 0.5 mm body | Package information | 2022-06-07 |
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