参数类型
| 型号 | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| 74CBTLV3126BQ | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | DHVQFN14 |
| 74CBTLV3126DS | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | SSOP16 |
| 74CBTLV3126PW | 2.3 - 3.6 | 3.3 | CMOS/LVTTL | 7 | 400 | 4 | 0.2 | very low | -40~125 | TSSOP14 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74CBTLV3126BQ | 74CBTLV3126BQ,115 (935289342115) |
Active | V3126 |
DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
| 74CBTLV3126DS | 74CBTLV3126DS,118 (935289343118) |
Active | TLV3126 |
SSOP16 (SOT519-1) |
SOT519-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
SOT519-1_118 |
| 74CBTLV3126PW | 74CBTLV3126PW,118 (935289344118) |
Active | TLV3126 |
TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| 74CBTLV3126BQ | 74CBTLV3126BQ,115 | 74CBTLV3126BQ |
|
|
| 74CBTLV3126DS | 74CBTLV3126DS,118 | 74CBTLV3126DS |
|
|
| 74CBTLV3126PW | 74CBTLV3126PW,118 | 74CBTLV3126PW |
|
|
文档 (14)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74CBTLV3126 | 4-bit bus switch | Data sheet | 2024-04-11 |
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| cbtlv3126 | 74CBTLV3126 IBIS model | IBIS model | 2015-02-23 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
| SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
| SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
| cbtlv3126 | 74CBTLV3126 IBIS model | IBIS model | 2015-02-23 |
Ordering, pricing & availability
样品
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如果您没有 Nexperia 的直接账户，我们的全球和地区分销商网络可为您提供 Nexperia 样品支持。查看官方经销商列表。