参数类型
型号 |
---|
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
CBT16212DGG | CBT16212DGG,112 (935270385112) |
Obsolete | CBT16212DGG Standard Procedure Standard Procedure |
TSSOP56 (SOT364-1) |
SOT364-1 |
SSOP-TSSOP-VSO-WAVE
|
暂无信息 |
CBT16212DGG,118 (935270385118) |
Obsolete | CBT16212DGG Standard Procedure Standard Procedure | SOT364-1_118 | ||||
CBT16212DL | CBT16212DL,512 (935270391512) |
Obsolete | CBT16212DL Standard Procedure Standard Procedure |
SSOP56 (SOT371-1) |
SOT371-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
CBT16212DL,518 (935270391518) |
Obsolete | CBT16212DL Standard Procedure Standard Procedure | 暂无信息 | ||||
CBT16212DL,112 (935270391112) |
Obsolete | CBT16212DL Standard Procedure Standard Procedure | 暂无信息 | ||||
CBT16212DL,118 (935270391118) |
Obsolete | CBT16212DL Standard Procedure Standard Procedure | 暂无信息 |
环境信息
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
CBT16212DGG | CBT16212DGG,112 | CBT16212DGG | ||
CBT16212DGG | CBT16212DGG,118 | CBT16212DGG | ||
CBT16212DL | CBT16212DL,512 | CBT16212DL | ||
CBT16212DL | CBT16212DL,518 | CBT16212DL | ||
CBT16212DL | CBT16212DL,112 | CBT16212DL | ||
CBT16212DL | CBT16212DL,118 | CBT16212DL |
文档 (12)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
CBT16212 | 24-bit bus exchange switch with 12-bit output enables | Data sheet | 2008-11-02 |
001aai356 | Block diagram: CBT16212DGG, CBT16212DL | Block diagram | 2009-11-03 |
001aai357 | Block diagram: CBT16212DGG, CBT16212DL | Block diagram | 2009-11-03 |
001aai358 | Block diagram: CBT16212DGG, CBT16212DL | Block diagram | 2009-11-03 |
SOT364-1 | 3D model for products with SOT364-1 package | Design support | 2020-01-22 |
cbt16212 | cbt16212 IBIS model | IBIS model | 2013-04-08 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SOT364-1 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | Package information | 2022-06-23 |
SOT371-1 | plastic, shrink small outline package; 56 leads; 0.635 mm pitch; 18.45 mm x 7.5 mm x 2.8 mm body | Package information | 2020-04-21 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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Ordering, pricing & availability
样品
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