外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT364-1 | TSSOP56 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | MO-153 (JEDEC) | 2003-02-19 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT364-1 | 3D model for products with SOT364-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT364-1 | plastic, thin shrink small outline package; 56 leads; 0.5 mm pitch; 14 mm x 6.1 mm x 1.2 mm body | Package information | 2022-06-23 |
| SOT364-1_118 | TSSOP56; Reel pack for SMD, 13"; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| 74ALVCH16646DGG | 16-bit bus transceiver/register; 3-state |
|