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74LVC30A
8-input NAND gate
The 74LVC30A is an 8-input NAND gate.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices in a mixed 3.3 V and 5 V environment.
Schmitt trigger action at all inputs makes the circuit tolerant for slower input rise and fall time.
This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.
Features and benefits
Wide supply voltage range from 1.2 V to 3.6 V
Inputs accept voltages up to 5.5 V
CMOS low power consumption
Direct interface with TTL levels
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JEDEC JS-001-2012 exceeds 2000 V
MM JESD22-A115-C exceeds 200 V
CDM JESD22-C101F exceeds 1000 V
Specified from ‑40 °C to +85 °C and ‑40 °C to +125 °C
Applications
参数类型
型号 |
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封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74LVC30ABQ | 74LVC30ABQX (935304015115) |
Obsolete | VC30A |
![]() DHVQFN14 (SOT762-1) |
SOT762-1 | SOT762-1_115 | |
74LVC30APW | 74LVC30APWJ (935304017118) |
Obsolete | LVC30A |
![]() TSSOP14 (SOT402-1) |
SOT402-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT402-1_118 |
环境信息
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
---|---|---|---|---|
74LVC30ABQ | 74LVC30ABQX | 74LVC30ABQ |
|
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74LVC30APW | 74LVC30APWJ | 74LVC30APW |
|
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文档 (11)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
74LVC30A | 8-input NAND gate | Data sheet | 2019-03-15 |
SOT762-1 | 3D model for products with SOT762-1 package | Design support | 2019-10-03 |
SOT402-1 | 3D model for products with SOT402-1 package | Design support | 2023-02-02 |
lvc30a | lvc30a IBIS model | IBIS model | 2018-11-29 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DHVQFN14_SOT762-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; no leads; 14 terminals; 0.5 mm pitch; 2.5 mm x 3 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
TSSOP14_SOT402-1_mk | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT762-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 14 terminals; 0.5 mm pitch; 2.5 x 3 x 1 mm body | Package information | 2023-04-05 |
SOT402-1 | plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-07 |
Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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Ordering, pricing & availability
样品
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