外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT1118 | DFN2020-6 | plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | 2013-06-06 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT1118 | 3D model for products with SOT1118 package | Design support | 2019-10-07 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020-6_SOT1118_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1118 | plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-06-02 |
SOT1118_115 | DFN2020-6; Reel pack for SMD, 7''; Q2/T3 product orientation | Packing information | 2020-06-12 |
SOT1118_184 | DFN2020-6; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2020-04-21 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
采用此封装的产品
Automotive qualified products (AEC-Q100/Q101)
型号 | 描述 | 快速访问 |
---|---|---|
PBSS4230PAN | 30 V, 2 A NPN/NPN low VCEsat (BISS) transistor |
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