外形图
| 封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
|---|---|---|---|---|
| SOT355-1 | TSSOP24 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | MO-153 (JEDEC) | 2024-11-07 |
相关文档
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT355-1 | 3D model for products with SOT355-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SOT355-1 | plastic, thin shrink small outline package; 24 leads; 0.65 mm pitch; 7.8 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SOT355-1_118 | TSSOP24; Reel pack for SMD 13''; Q1/T1 product orientation | Packing information | 2020-04-21 |
| SOT355-1_128 | TSSOP24; Reel pack, SMD, 13" Q4/T2 standard product orientation Orderable part number ending ,128 Ordering code (12NC) ending 128 | Packing information | 2020-04-27 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
采用此封装的产品
Analog & Logic ICs
| 型号 | 描述 | 快速访问 |
|---|---|---|
| NCA9535PW-Q100 | Low-voltage 16-bit I²C and SMBus low-power I/O expander with interrupt output and configuration registers |
|