外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT363 | TSSOP6 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | SC-88; SC-70-6 (EIAJ) | 2006-03-16 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
AN90032 | Low temperature soldering, application study | Application note | 2022-02-22 |
Nexperia_document_guide_MiniLogic_PicoGate_201901 | PicoGate leaded logic portfolio guide | Brochure | 2019-01-07 |
SOT363 | 3D model for products with SOT363 package | Design support | 2018-12-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP6_SOT363_mk | plastic, surface-mounted package; 6 leads; 1.3 mm pitch; 2 mm x 1.25 mm x 0.95 mm body | Marcom graphics | 2017-01-28 |
SOT363 | plastic, surface-mounted package; 6 leads; 0.65 mm pitch; 2.1 mm x 1.25 mm x 0.95 mm body | Package information | 2022-06-01 |
SOT363_115 | TSSOP6; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2020-06-12 |
SOT363_125 | TSSOP6 ; Reel pack for SMD, 7"; Q3/T4 product orientation | Packing information | 2020-04-21 |
SOT363_135 | TSSOP6; Tape reel SMD; standard product orientation 12NC ending 135 | Packing information | 2020-04-27 |
SOT363_165 | TSSOP6 ; Reel pack for SMD, 11"; Q3/T4 product orientation | Packing information | 2024-01-24 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
MAR_SOT363 | MAR_SOT363 Topmark | Top marking | 2013-06-03 |
WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
采用此封装的产品
Automotive qualified products (AEC-Q100/Q101)
型号 | 描述 | 快速访问 |
---|---|---|
BAT54XY | Schottky barrier quadruple diode |
|