外形图
封装版本 | 封装名称 | 封装说明 | 参考 | 发行日期 |
---|---|---|---|---|
SOT8062-1 | HTSSOP | Plastic, thermal enhanced thin shrink small outline package; 8 leads, 0.65 mm pitch, 3 mm × 3 mm × 1.1 mm body | MO-187 (AA) (JEDEC) | 2024-10-29 |
相关文档
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT8062-1 | Plastic, thermal enhanced thin shrink small outline package; 8 leads,0.65 mm pitch, 3 mm × 3 mm × 1.1 mm body | Package information | 2024-11-07 |
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