双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74CBTLV3257-Q100

Quad 1-of-2 multiplexer/demultiplexer

The 74CBTLV3257-Q100 provides a quad 1-of-2 high-speed multiplexer/demultiplexer with common select (S) and output enable (OE) inputs. The low ON resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. When pin OE = LOW, one of the two switches is selected (low-impedance ON-state) with pin S. When pin OE = HIGH, all switches are in the high-impedance OFF-state, independent of pin S. To ensure the high-impedance OFF-state during power-up or power-down, OE should be tied to the VCC through a pull-up resistor. The current-sinking capability of the driver determines the minimum value of the resistor.

Schmitt trigger action at control input, makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 2.3 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Supply voltage range from 2.3 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V)

  • 5 Ω switch connection between two ports

  • Rail to rail switching on data I/O ports

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA per JESD78B Class I level A

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) RON (Ω) Logic switching levels tpd (ns) Power dissipation considerations Tamb (°C) Package name
74CBTLV3257BQ-Q100 2.3 - 3.6 7 CMOS/LVTTL 0.2 very low -40~125 DHVQFN16
74CBTLV3257D-Q100 2.3 - 3.6 7 CMOS/LVTTL 0.2 very low -40~125 SO16
74CBTLV3257PW-Q100 2.3 - 3.6 7 CMOS/LVTTL 0.2 very low -40~125 TSSOP16

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74CBTLV3257BQ-Q100 74CBTLV3257BQ-Q10X
(935302227115)		 Active TV3257 SOT763-1
DHVQFN16
(SOT763-1) 		SOT763-1 SOT763-1_115
74CBTLV3257D-Q100 74CBTLV3257D-Q100J
(935302231118)		 Active 74CBTLV3257D SOT109-1
SO16
(SOT109-1) 		SOT109-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT109-1_118
74CBTLV3257PW-Q100 74CBTLV3257PW-Q10J
(935302229118)		 Active TLV3257 SOT403-1
TSSOP16
(SOT403-1) 		SOT403-1 SSOP-TSSOP-VSO-WAVE
SOT403-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74CBTLV3257BQ-Q100 74CBTLV3257BQ-Q10X 74CBTLV3257BQ-Q100 rohs rhf rhf
74CBTLV3257D-Q100 74CBTLV3257D-Q100J 74CBTLV3257D-Q100 rohs rhf rhf
74CBTLV3257PW-Q100 74CBTLV3257PW-Q10J 74CBTLV3257PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (17)

文件名称 标题 类型 日期
74CBTLV3257_Q100 Quad 1-of-2 multiplexer/demultiplexer Data sheet 2024-02-01
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
cbtlv3257 IBIS model of 74CBTLV3257 IBIS model 2017-12-11
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN16_SOT763-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body Marcom graphics 2017-01-28
SO16_SOT109-1_mk plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body Marcom graphics 2017-01-28
TSSOP16_SOT403-1_mk plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT763-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body Package information 2023-05-11
SOT109-1 plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body Package information 2023-11-07
SOT403-1 plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body Package information 2023-11-08
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT763-1 3D model for products with SOT763-1 package Design support 2019-10-03
SOT109-1 3D model for products with SOT109-1 package Design support 2020-01-22
SOT403-1 3D model for products with SOT403-1 package Design support 2020-01-22
cbtlv3257 IBIS model of 74CBTLV3257 IBIS model 2017-12-11

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