参数类型
| 型号 | VCC (V) | VPASS (V) | Logic switching levels | RON (Ω) | f(-3dB) (MHz) | Nr of bits | tpd (ns) | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|
| CBT3257ABQ | 4.5 - 5.5 | 3.9 | TTL | 7 | 300 | 4 | 0.25 | very low | -40~85 | DHVQFN16 |
| CBT3257AD | 4.5 - 5.5 | 3.9 | TTL | 7 | 300 | 4 | 0.25 | very low | -40~85 | SO16 |
| CBT3257ADS | 4.5 - 5.5 | 3.9 | TTL | 7 | 300 | 4 | 0.25 | very low | -40~85 | SSOP16 |
| CBT3257APW | 4.5 - 5.5 | 3.9 | TTL | 7 | 300 | 4 | 0.25 | very low | -40~85 | TSSOP16 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| CBT3257ABQ | CBT3257ABQ,115 (935285609115) |
Active | 3257A |
DHVQFN16 (SOT763-1) |
SOT763-1 | SOT763-1_115 | |
| CBT3257AD | CBT3257AD,118 (935275888118) |
Active | CBT3257AD |
SO16 (SOT109-1) |
SOT109-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT109-1_118 |
| CBT3257ADS | CBT3257ADS,118 (935275891118) |
Active | CT3257A |
SSOP16 (SOT519-1) |
SOT519-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
SOT519-1_118 |
| CBT3257APW | CBT3257APW,118 (935275892118) |
Active | CT3257A |
TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| CBT3257ADB | CBT3257ADB,112 (935275889112) |
Obsolete | no package information | ||||
| CBT3257ADB,118 (935275889118) |
Obsolete | ||||||
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBT3257ABQ | CBT3257ABQ,115 | CBT3257ABQ |
|
|
| CBT3257AD | CBT3257AD,118 | CBT3257AD |
|
|
| CBT3257ADS | CBT3257ADS,118 | CBT3257ADS |
|
|
| CBT3257APW | CBT3257APW,118 | CBT3257APW |
|
|
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| CBT3257ADB | CBT3257ADB,112 | CBT3257ADB |
|
|
| CBT3257ADB | CBT3257ADB,118 | CBT3257ADB |
|
|
文档 (24)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| CBT3257A | Quad 1-of-2 multiplexer/demultiplexer | Data sheet | 2024-04-18 |
| AN90010 | Pin FMEA for CBT(D) family | Application note | 2019-10-28 |
| 002aab779 | Block diagram: CBT3257ABQ, CBT3257AD, CBT3257ADB, CBT3257ADS, CBT3257APW | Block diagram | 2009-11-04 |
| sa00012 | Block diagram: CBT3257ABQ, CBT3257AD, CBT3257ADB, CBT3257ADS, CBT3257APW | Block diagram | 2009-11-03 |
| sa00638 | Block diagram: CBT3257ABQ, CBT3257AD, CBT3257ADB, CBT3257ADS, CBT3257APW | Block diagram | 2009-11-04 |
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| cbt3257a | CBT3257A IBIS model | IBIS model | 2019-06-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN16_SOT763-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| SO16_SOT109-1_mk | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm body | Marcom graphics | 2017-01-28 |
| TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT763-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm body | Package information | 2023-05-11 |
| SOT109-1 | plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SOT519-1 | plastic, shrink small outline package; 16 leads; 0.635 mm pitch; 4.9 mm x 3.9 mm x 1.73 mm body | Package information | 2022-06-20 |
| SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| SOT763-1 | 3D model for products with SOT763-1 package | Design support | 2019-10-03 |
| SOT109-1 | 3D model for products with SOT109-1 package | Design support | 2020-01-22 |
| SOT519-1 | 3D model for products with SOT519-1 package | Design support | 2023-02-07 |
| SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
| cbt3257a | CBT3257A IBIS model | IBIS model | 2019-06-13 |
Ordering, pricing & availability
样品
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