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Click here for more information74AUP2G16GX
参数类型
型号 | Package name |
---|---|
74AUP2G16GX | X2SON6 |
封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
74AUP2G16GX | 74AUP2G16GXZ (935307653147) |
Obsolete | 5A According NX3-00133 According NX3-00133 |
![]() X2SON6 (SOT1255) |
SOT1255 |
REFLOW_BG-BD-1
|
SOT1255_147 |
文档 (8)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
aup2g16 | 74AUP2G16 IBIS model | IBIS model | 2015-10-30 |
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
X2SON6_SOT1255_mk | "plastic, thermal enhanced extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 0.8 mm x 0.35 mm body" | Marcom graphics | 2017-01-28 |
SOT1255 | plastic, leadless thermal enhanced extremely thin small outline package; 6 terminals; 0.4 mm pitch; 1 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-31 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
支持
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
aup2g16 | 74AUP2G16 IBIS model | IBIS model | 2015-10-30 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.