双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC2G241

Dual buffer/line driver; 3-state

The 74LVC2G241 is a dual non-inverting buffer/line driver with 3-state outputs. The 3-state outputs are controlled by the output enable inputs 1OE and 2OE:

  • A HIGH level at pin 1OE causes output 1Y to assume a high-impedance OFF-state.

  • A LOW level at pin 2OE causes output 2Y to assume a high-impedance OFF-state.

Schmitt trigger action at all inputs makes the circuit highly tolerant of slower input rise and fall times.

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of the 74LVC2G241 as a translator in a mixed 3.3 V and 5 V environment.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.65 V to 5.5 V

  • 5 V tolerant input/output for interfacing with 5 V logic

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • Inputs accept voltages up to 5 V

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74LVC2G241DC 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 VSSOP8
74LVC2G241DP 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 TSSOP8
74LVC2G241GN 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 XSON8
74LVC2G241GS 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 XSON8
74LVC2G241GT 1.65 - 5.5 CMOS/LVTTL ± 32 175 2 low -40~125 XSON8

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC2G241DC 74LVC2G241DC,125
(935274509125)		 Active V41 SOT765-1
VSSOP8
(SOT765-1) 		SOT765-1 SOT765-1_125
74LVC2G241DP 74LVC2G241DP,125
(935272006125)		 Active V241 SOT505-2
TSSOP8
(SOT505-2) 		SOT505-2 SOT505-2_125
74LVC2G241GN 74LVC2G241GN,115
(935292243115)		 Active V1 SOT1116
XSON8
(SOT1116) 		SOT1116 REFLOW_BG-BD-1
SOT1116_115
74LVC2G241GS 74LVC2G241GS,115
(935292798115)		 Active V1 SOT1203
XSON8
(SOT1203) 		SOT1203 REFLOW_BG-BD-1
SOT1203_115
74LVC2G241GT 74LVC2G241GT,115
(935278926115)		 Active V41 SOT833-1
XSON8
(SOT833-1) 		SOT833-1 SOT833-1_115

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC2G241GD 74LVC2G241GD,125
(935286856125)		 Obsolete V41 Standard Procedure Standard Procedure SOT996-2
XSON8
(SOT996-2) 		SOT996-2 SOT996-2_125
74LVC2G241GM 74LVC2G241GM,125
(935277234125)		 Obsolete V41 SOT902-2
XQFN8
(SOT902-2) 		SOT902-2 SOT902-2_125
74LVC2G241GM,115
(935277234115)		 Obsolete V41 暂无信息

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC2G241DC 74LVC2G241DC,125 74LVC2G241DC rohs rhf rhf
74LVC2G241DP 74LVC2G241DP,125 74LVC2G241DP rohs rhf rhf
74LVC2G241GN 74LVC2G241GN,115 74LVC2G241GN rohs rhf rhf
74LVC2G241GS 74LVC2G241GS,115 74LVC2G241GS rohs rhf rhf
74LVC2G241GT 74LVC2G241GT,115 74LVC2G241GT rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC2G241GD 74LVC2G241GD,125 74LVC2G241GD rohs rhf rhf
74LVC2G241GM 74LVC2G241GM,125 74LVC2G241GM rohs rhf rhf
74LVC2G241GM 74LVC2G241GM,115 74LVC2G241GM rohs rhf rhf
品质及可靠性免责声明

文档 (28)

文件名称 标题 类型 日期
74LVC2G241 Dual buffer/line driver; 3-state Data sheet 2024-04-30
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
mna729 Block diagram: 74LVC2G241DC, 74LVC2G241DP, 74LVC2G241GD, 74LVC2G241GM, 74LVC2G241GT Block diagram 2009-11-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT505-2 3D model for products with SOT505-2 package Design support 2019-01-18
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
lvc2g241 74LVC2G241 IBIS model IBIS model 2014-10-20
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
VSSOP8_SOT765-1_mk plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Marcom graphics 2017-01-28
XQFN8_SOT902-2_mk plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON8_SOT1203_mk plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Marcom graphics 2019-02-04
SOT765-1 plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Package information 2022-06-03
SOT505-2 plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body Package information 2022-06-03
SOT996-2 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body Package information 2020-04-21
SOT902-2 plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body Package information 2020-04-21
SOT1116 plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body Package information 2022-06-02
SOT1203 plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Package information 2022-06-03
SOT833-1 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body Package information 2022-06-03
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT1116 MAR_SOT1116 Topmark Top marking 2013-06-03
MAR_SOT1203 MAR_SOT1203 Topmark Top marking 2013-06-03
MAR_SOT833 MAR_SOT833 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT505-2 3D model for products with SOT505-2 package Design support 2019-01-18
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
lvc2g241 74LVC2G241 IBIS model IBIS model 2014-10-20

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