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Click here for more information74HC137DB
3-to-8 line decoder, demultiplexer with address latches; inverting
The 74HC137 decodes three binary weighted address inputs (A0, A1 and A2) to eight mutually exclusive outputs (Y0 to Y7). The device features a latch enable (LE) and two output enable (E1, E2) inputs. A LOW on LE causes the device to act as an active LOW decoder. A LOW-to HIGH transition on LE stores the data that was present before the transition in the latches. Further address changes are ignored as long as LE remains HIGH.
The output enable inputs control the state of the outputs independently of the address inputs or latch operation. All outputs will be HIGH unless E1 is LOW and E2 is HIGH.
Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
Alternatives
Features and benefits
Combines 3-to-8 decoder with 3-bit latch
Multiple input enable for easy expansion or independent controls
Active LOW mutually exclusive outputs
Wide supply voltage range from 2.0 to 6.0 V
CMOS low power dissipation
High noise immunity
Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
Complies with JEDEC standards
JESD8C (2.7 V to 3.6 V)
JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Specified from -40 °C to +80 °C and from -40 °C to +125 °C.
参数类型
型号 | Package name |
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74HC137DB | SSOP16 |
PCB Symbol, Footprint and 3D Model
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封装
下表中的所有产品型号均已停产 。
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
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74HC137DB | 74HC137DB,112 (935189660112) |
Withdrawn / End-of-life | HC137 |
SSOP16 (SOT338-1) |
SOT338-1 |
SSOP-TSSOP-VSO-REFLOW
SSOP-TSSOP-VSO-WAVE |
暂无信息 |
74HC137DB,118 (935189660118) |
Obsolete | HC137 | 暂无信息 |
文档 (8)
文件名称 | 标题 | 类型 | 日期 |
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74HC137 | 3-to-8 line decoder, demultiplexer with address latches; inverting | Data sheet | 2024-01-11 |
AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
SSOP16_SOT338-1_mk | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Marcom graphics | 2017-01-28 |
SOT338-1 | plastic, shrink small outline package; 16 leads; 0.65 mm pitch; 6.2 mm x 5.3 mm x 2 mm body | Package information | 2022-06-20 |
SSOP-TSSOP-VSO-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
HCT_USER_GUIDE | HC/T User Guide | User manual | 1997-10-31 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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模型
No documents available
PCB Symbol, Footprint and 3D Model
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How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.