双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74ALVC374

Octal D-type flip-flop; positive-edge trigger; 3-state

The 74ALVC374 is an octal positive-edge triggered D-type flip-flop with 3-state outputs. The device features a clock (CP) and output enable (OE) inputs. The flip-flops will store the state of their individual D-inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A HIGH on OE causes the outputs to assume a high-impedance OFF-state. Operation of the OE input does not affect the state of the flip-flops.

Schmitt trigger action on all inputs makes the device tolerant of slow rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.65 V to 3.6 V

  • CMOS low power dissipation

  • Overvoltage tolerant inputs to 3.6 V

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance exceeds 250 mA per JESD78 Class II.A

  • Complies with JEDEC standards:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C/JESD36 (2.7 V to 3.6 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Package name
74ALVC374BQ 1.65 - 3.6 TTL ± 24 2.5 300 low -40~85 DHVQFN20
74ALVC374D 1.65 - 3.6 TTL ± 24 2.5 300 low -40~85 SO20
74ALVC374PW 1.65 - 3.6 TTL ± 24 2.5 300 low -40~85 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74ALVC374BQ 74ALVC374BQ,115
(935285558115)		 Active ALVC374 SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74ALVC374D 74ALVC374D,118
(935269733118)		 Active 74ALVC374D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74ALVC374PW 74ALVC374PW,118
(935269732118)		 Active ALVC374 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74ALVC374BQ 74ALVC374BQ,115 74ALVC374BQ rohs rhf rhf
74ALVC374D 74ALVC374D,118 74ALVC374D rohs rhf rhf
74ALVC374PW 74ALVC374PW,118 74ALVC374PW rohs rhf rhf
品质及可靠性免责声明

文档 (15)

文件名称 标题 类型 日期
74ALVC374 Octal D-type flip-flop; positive-edge trigger; 3-state Data sheet 2023-07-10
mna449 Block diagram: 74ALVC374BQ, 74ALVC374D, 74ALVC374PW Block diagram 2009-11-04
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
alvc374 alvc374 IBIS model IBIS model 2013-04-08
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2022-06-20
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Package information 2022-06-21
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

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模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
alvc374 alvc374 IBIS model IBIS model 2013-04-08

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