双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74HC273-Q100; 74HCT273-Q100

Octal D-type flip-flop with reset; positive-edge trigger

The 74HC273-Q100; 74HCT273-Q100 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 2.0 V to 6.0 V

  • CMOS low power dissipation

  • High noise immunity

  • Latch-up performance exceeds 100 mA per JESD 78 Class II Level B

  • Complies with JEDEC standards:

    • JESD8C (2.7 V to 3.6 V)
    • JESD7A (2.0 V to 6.0 V)

  • Input levels:

    • For 74HC273-Q100: CMOS level

    • For 74HCT273-Q100: TTL level

  • Common clock and master reset

  • Eight positive edge-triggered D-type flip-flops

  • ESD protection:

    • HBM JESD22-A114F exceeds 2000 V

    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)

  • Multiple package options

  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Package name
74HC273BQ-Q100 2.0 - 6.0 CMOS ± 5.2 15 122 low -40~125 DHVQFN20
74HC273D-Q100 2.0 - 6.0 CMOS ± 5.2 15 122 low -40~125 SO20
74HC273PW-Q100 2.0 - 6.0 CMOS ± 5.2 15 122 low -40~125 TSSOP20
74HCT273BQ-Q100 4.5 - 5.5 TTL ± 4 15 36 low -40~125 DHVQFN20
74HCT273D-Q100 4.5 - 5.5 TTL ± 4 15 36 low -40~125 SO20
74HCT273PW-Q100 4.5 - 5.5 TTL ± 4 15 36 low -40~125 TSSOP20

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74HC273BQ-Q100 74HC273BQ-Q100X
(935301457115)		 Active HC273BQ SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74HC273D-Q100 74HC273D-Q100J
(935301455118)		 Active 74HC273D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74HC273PW-Q100 74HC273PW-Q100J
(935301456118)		 Active HC273 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118
74HCT273BQ-Q100 74HCT273BQ-Q100X
(935301461115)		 Active HCT273BQ SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
74HCT273D-Q100 74HCT273D-Q100J
(935301458118)		 Active 74HCT273D SOT163-1
SO20
(SOT163-1) 		SOT163-1 WAVE_BG-BD-1
SOT163-1_118
74HCT273PW-Q100 74HCT273PW-Q100J
(935301459118)		 Active HCT273 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74HC273BQ-Q100 74HC273BQ-Q100X 74HC273BQ-Q100 rohs rhf rhf
74HC273D-Q100 74HC273D-Q100J 74HC273D-Q100 rohs rhf rhf
74HC273PW-Q100 74HC273PW-Q100J 74HC273PW-Q100 rohs rhf rhf
74HCT273BQ-Q100 74HCT273BQ-Q100X 74HCT273BQ-Q100 rohs rhf rhf
74HCT273D-Q100 74HCT273D-Q100J 74HCT273D-Q100 rohs rhf rhf
74HCT273PW-Q100 74HCT273PW-Q100J 74HCT273PW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (15)

文件名称 标题 类型 日期
74HC_HCT273_Q100 Octal D-type flip-flop with reset; positive-edge trigger Data sheet 2020-09-15
AN11044 Pin FMEA 74HC/74HCT family Application note 2019-01-09
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT163-1 plastic, small outline package; 20 leads; 1.27 mm pitch; 12.8 mm x 7.5 mm x 2.65 mm body Package information 2022-06-20
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Package information 2022-06-21
hc HC/HCT Spice model SPICE model 2022-02-17
HCT_USER_GUIDE HC/T User Guide User manual 1997-10-31
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT163-1 3D model for products with SOT163-1 package Design support 2020-01-22
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
hc HC/HCT Spice model SPICE model 2022-02-17

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