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HEF40175B-Q100
Quad D-type flip-flop
The HEF40175B-Q100 is a quad positive edge triggered D-type flip-flop with four data (Dn) inputs, common clock (CP) and asynchronous master reset (MR) inputs, and complementary Qn and Qn outputs. When MR is HIGH data at the D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition will be stored in the flip-flop and appear at the Q output. When LOW, MR resets all flip-flops (Qn = LOW, Qn = HIGH), independent of CP and Dn. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VDD.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 3.0 V to 15.0 V
CMOS low power dissipation
High noise immunity
Fully static operation
5 V, 10 V, and 15 V parametric ratings
Standardized symmetrical output characteristics
Complies with JEDEC standard JESD 13-B
-
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-B exceeds 200 V
Applications
Shift registers
Buffer/storage register
Pattern generator
参数类型
型号 | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Power dissipation considerations | Tamb (°C) | Package name |
---|---|---|---|---|---|---|---|---|
HEF40175BTT-Q100 | 3.0 - 15 | CMOS | ± 2.4 | 25 | 45 | low | -40~85 | TSSOP16 |
封装
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
HEF40175BTT-Q100 | HEF40175BTT-Q100J (935691615118) |
Active | HF40175 |
![]() TSSOP16 (SOT403-1) |
SOT403-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT403-1_118 |
文档 (6)
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
HEF40175B_Q100 | Quad D-type flip-flop | Data sheet | 2023-10-20 |
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
TSSOP16_SOT403-1_mk | plastic, thin shrink small outline package; 16 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
SOT403-1 | plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.2 mm body | Package information | 2023-11-08 |
SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
支持
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模型
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
SOT403-1 | 3D model for products with SOT403-1 package | Design support | 2020-01-22 |
Ordering, pricing & availability
样品
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