双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC1G08-Q100

Single 2-input AND gate

The 74LVC1G08-Q100 is a single 2-input AND gate. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V applications.

Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall time.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C

  • Wide supply voltage range from 1.65 V to 5.5 V

  • High noise immunity

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power dissipation

  • Direct interface with TTL levels

  • Overvoltage tolerant inputs to 5.5 V

  • IOFF circuitry provides partial Power-down mode operation

  • Latch-up performance ≤ 250 mA

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74LVC1G08GM-Q100 1.65 - 5.5 CMOS/LVTTL ± 24 2.1 150 1 low -40~125 XSON6
74LVC1G08GV-Q100 1.65 - 5.5 CMOS/LVTTL ± 24 2.1 150 1 low -40~125 TSOP5
74LVC1G08GW-Q100 1.65 - 5.5 CMOS/LVTTL ± 24 2.1 150 1 low -40~125 TSSOP5

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC1G08GM-Q100 74LVC1G08GM-Q100X
(935690713115)		 Active VE SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115
74LVC1G08GV-Q100 74LVC1G08GV-Q100,1
(935298475125)		 Active V08 SOT753
TSOP5
(SOT753) 		SOT753 REFLOW_BG-BD-1
WAVE_BG-BD-1
SOT753_125
74LVC1G08GW-Q100 74LVC1G08GW-Q100,1
(935298476125)		 Active VE SOT353-1
TSSOP5
(SOT353-1) 		SOT353-1 WAVE_BG-BD-1
SOT353-1_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC1G08GM-Q100 74LVC1G08GM-Q100X 74LVC1G08GM-Q100 rohs rhf rhf
74LVC1G08GV-Q100 74LVC1G08GV-Q100,1 74LVC1G08GV-Q100 rohs rhf rhf
74LVC1G08GW-Q100 74LVC1G08GW-Q100,1 74LVC1G08GW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (23)

文件名称 标题 类型 日期
74LVC1G08_Q100 Single 2-input AND gate Data sheet 2023-08-04
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
mna113 Block diagram: 74AHC1G08GV, 74AHC1G08GW, 74AHCT1G08GV, 74AHCT1G08GW, 74HC1G08GV, 74HC1G08GW, 74HCT1G08GV, 74HCT1G08GW, 74LVC1G08GF, 74LVC1G08GM, 74LVC1G08GV, 74LVC1G08GW Block diagram 2009-11-03
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
lvc1g08 74LVC1G08 IBIS model IBIS model 2014-10-20
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
TSSOP5_SOT353-1_mk plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm body Marcom graphics 2018-07-25
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT753 plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body Package information 2022-05-31
SOT353-1 plastic thin shrink small outline package; 5 leads; body width 1.25 mm Package information 2022-11-15
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT753 MAR_SOT753 Topmark Top marking 2013-06-03
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

支持

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模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT753 3D model for products with SOT753 package Design support 2019-01-22
SOT353-1 3D model for products with SOT353-1 package Design support 2019-09-23
lvc1g08 74LVC1G08 IBIS model IBIS model 2014-10-20

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