双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74AUP3G0434

Low-power dual inverter and single buffer

The 74AUP3G0434 is a dual inverter and single buffer.

Schmitt trigger action at all inputs makes the circuit tolerant of slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial Power-down applications using IOFF. The IOFF circuitry disables the output, preventing a damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V

  • High noise immunity

  • Complies with JEDEC standards:

    • JESD8-12 (0.8 V to 1.3 V)

    • JESD8-11 (0.9 V to 1.65 V)

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8-B (2.7 V to 3.6 V)

  • Low static power consumption; ICC = 0.9 μA (maximum)

  • Latch-up performance exceeds 100 mA per JESD 78B Class II

  • Inputs accept voltages up to 3.6 V

  • Low noise overshoot and undershoot < 10 % of VCC

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 5000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74AUP3G0434DC 0.8 - 3.6 CMOS ± 1.9 4.0 70 3 ultra low -40~125 VSSOP8
74AUP3G0434GN 0.8 - 3.6 CMOS ± 1.9 4.0 70 3 ultra low -40~125 XSON8
74AUP3G0434GS 0.8 - 3.6 CMOS ± 1.9 4.0 70 3 ultra low -40~125 XSON8
74AUP3G0434GT 0.8 - 3.6 CMOS ± 1.9 4.0 70 3 ultra low -40~125 XSON8

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP3G0434DC 74AUP3G0434DCH
(935299438125)		 Active pZ SOT765-1
VSSOP8
(SOT765-1) 		SOT765-1 SOT765-1_125
74AUP3G0434GN 74AUP3G0434GNX
(935299443115)		 Active pZ SOT1116
XSON8
(SOT1116) 		SOT1116 REFLOW_BG-BD-1
SOT1116_115
74AUP3G0434GS 74AUP3G0434GSX
(935299444115)		 Active pZ SOT1203
XSON8
(SOT1203) 		SOT1203 REFLOW_BG-BD-1
SOT1203_115
74AUP3G0434GT 74AUP3G0434GTX
(935299445115)		 Active pZ SOT833-1
XSON8
(SOT833-1) 		SOT833-1 SOT833-1_115

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP3G0434GD 74AUP3G0434GDH
(935299439125)		 Withdrawn / End-of-life pZ SOT996-2
XSON8
(SOT996-2) 		SOT996-2 SOT996-2_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP3G0434DC 74AUP3G0434DCH 74AUP3G0434DC rohs rhf rhf
74AUP3G0434GN 74AUP3G0434GNX 74AUP3G0434GN rohs rhf rhf
74AUP3G0434GS 74AUP3G0434GSX 74AUP3G0434GS rohs rhf rhf
74AUP3G0434GT 74AUP3G0434GTX 74AUP3G0434GT rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP3G0434GD 74AUP3G0434GDH 74AUP3G0434GD rohs rhf rhf
品质及可靠性免责声明

文档 (23)

文件名称 标题 类型 日期
74AUP3G0434 Low-power dual inverter and single buffer Data sheet 2024-04-26
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
aup3g0434 IBIS model IBIS model 2014-06-04
Nexperia_document_Logic_CombinationLogic_infocard_201710 Combination logic solutions card Leaflet 2019-08-09
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
VSSOP8_SOT765-1_mk plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Marcom graphics 2017-01-28
XSON8_SOT1203_mk plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Marcom graphics 2019-02-04
SOT765-1 plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Package information 2022-06-03
SOT996-2 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body Package information 2020-04-21
SOT1116 plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body Package information 2022-06-02
SOT1203 plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Package information 2022-06-03
SOT833-1 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body Package information 2022-06-03
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT1116 MAR_SOT1116 Topmark Top marking 2013-06-03
MAR_SOT1203 MAR_SOT1203 Topmark Top marking 2013-06-03
MAR_SOT833 MAR_SOT833 Topmark Top marking 2013-06-03

支持

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模型

文件名称 标题 类型 日期
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
aup3g0434 IBIS model IBIS model 2014-06-04

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