Features and benefits
- Wide operating voltage: 1.0 V to 5.5 V
- Optimized for low voltage applications: 1.0 V to 3.6 V
- Accepts TTL input levels between VCC = 2.7 V and VCC = 3.6 V
- Typical output ground bounce < 0.8 V at VCC = 3.3 V and Tamb = 25 °C
- Typical HIGH-level output voltage (VOH) undershoot: > 2 V at VCC = 3.3 V and Tamb = 25 °C
- ESD protection:
- HBM JESD22-A114E exceeds 2000 V
- MM JESD22-A115-A exceeds 200 V
- Multiple package options
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Applications
参数类型
| 型号 |
|---|
封装
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| 74LV86D | 74LV86D,112 (935081260112) |
Obsolete | 74LV86D Standard Procedure Standard Procedure |
SO14 (SOT108-1) |
SOT108-1 |
SO-SOJ-REFLOW
SO-SOJ-WAVE WAVE_BG-BD-1 |
SOT108-1_112 |
| 74LV86D,118 (935081260118) |
Obsolete | 74LV86D Standard Procedure Standard Procedure | SOT108-1_118 |
文档 (9)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| 74LV86 | Quad 2-input exclusive-OR gate | Data sheet | 2007-11-26 |
| SOT108-1 | 3D model for products with SOT108-1 package | Design support | 2020-01-22 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| SO14_SOT108-1_mk | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Marcom graphics | 2017-01-28 |
| SOT108-1 | plastic, small outline package; 14 leads; 1.27 mm pitch; 8.65 mm x 3.9 mm x 1.75 mm body | Package information | 2023-11-07 |
| SO-SOJ-REFLOW | Footprint for reflow soldering | Reflow soldering | 2009-10-08 |
| Nexperia_Selection_guide_2023 | Nexperia Selection Guide 2023 | Selection guide | 2023-05-10 |
| SO-SOJ-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
