When it comes to designing any circuit, a key challenge is to see how you can pack all the functionality you need onto the available PCB space. For some applications this can be relatively straight forward, while for others it can be the ultimate test. As a leading expert in the high-volume production of essential semiconductors, Nexperia is intimately aware of this challenge. That’s why we continue to offer proven, well-known packages while at the same time innovating to reduce footprint and increase thermal and electrical performance.
When it comes to highlighting Nexperia’s range of package options our Analog and Logic ICs portfolio gives a great overview of available footprint choice. Naturally logic devices are not always the first onto any board design, so it can be added challenge when they do need to be added at the last minute. But with a choice of the 48-pin leaded SMD TSSOP48 (12.8 x 6.1 x 1.2 mm) package through to the thermally enhanced, 4-terminal leadless X2SON4 (0.6 x 0.6 x 0.32 mm), Nexperia has options to fit virtually every design.
But of course our offer doesn’t end there. When it comes to shrinking footprints, we continue to push towards ever more space efficient packages with chip-scale and near chip scale encapsulation options. From a performance perspective, our leaded clip-bond technology delivers real thermal and package resistance benefits. And our leadless package options with side wettable flanks meet the demand for Automated Optical Inspection (AOI) of PCBs.
So check out some of the possiblities Nexperia has to help you fit all the functionality you need onto the available PCB space, starting by getting your own Analog & Logic ICs packages card.