可订购部件
型号 | 可订购的器件编号 | 订购代码(12NC) | 封装 | 从经销商处购买 |
---|---|---|---|---|
PBSS4360PAS | PBSS4360PASX | 934069625115 | SOT1061D | 订单产品 |
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Click here for more information60 V, 3 A NPN low VCEsat transistor
NPN low VCEsat transistor, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and soldarable side pads.
PNP complement: PBSS5360PAS
Low collector-emitter saturation voltage VCEsat
High collector current capability IC and ICM
High collector current gain (hFE) at high IC
High efficiency due to less heat generation
High temperature applications up to 175 °C
Reduced Printed-Circuit Board (PCB) area requirements
Leadless small SMD plastic package with soldarable side pads
Exposed heat sink for excellent thermal and electrical conductivity
Suitable for Automatic Optical Inspection (AOI) of solder joint
Loadswitch
Battery-driven devices
Power management
Charging circuits
Power switches (e.g. motors, fans)
型号 | Package version | Package name | Size (mm) | channel type (e) | Ptot (mW) | VCEO [max] (V) | IC [max] (mA) | hFE [min] | TJ [max] (°C) | fT [min] (MHz) | Automotive qualified |
---|---|---|---|---|---|---|---|---|---|---|---|
PBSS4360PAS | SOT1061D | DFN2020D-3 | 2 x 2 x 0.65 | NPN | 600 | 60 | 3000 | 200 | 175 | 75 | N |
型号 | 可订购的器件编号,(订购码(12NC)) | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
---|---|---|---|---|---|---|---|
PBSS4360PAS | PBSS4360PASX (934069625115) |
Active | E9 |
![]() DFN2020D-3 (SOT1061D) |
SOT1061D |
REFLOW_BG-BD-1
|
SOT1061D_115 |
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS4360PAS | 60 V, 3 A NPN low VCEsat transistor | Data sheet | 2023-07-03 |
AN90023 | Thermal performance of DFN packages | Application note | 2020-11-23 |
AN90023_ZH | Thermal performance of DFN packages | Application note | 2021-02-26 |
Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
Nexperia_asset_document_brochure_autoDFN_CN_LR | 小巧轻便的汽车 二极管和晶体管 | Brochure | 2022-04-26 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
Nexperia_AutoDFN_factsheet_2022 | Small & light automotive diodes and transistors | Leaflet | 2022-04-13 |
Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
DFN2020D-3_SOT1061D_mk | plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Marcom graphics | 2017-01-28 |
SOT1061D | plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body | Package information | 2022-10-10 |
SOT1061D_115 | DFN2020D-3; Reel pack for SMD, 7"; Q2/T3 product orientation | Packing information | 2020-05-29 |
PBSS4360PAS_Nexperia_Product_Quality | PBSS4360PAS Nexperia Product Quality | Quality document | 2019-05-20 |
PBSS4360PAS_Nexperia_Product_Reliability | PBSS4360PAS Nexperia Product Reliability | Quality document | 2024-04-23 |
REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
PBSS4360PAS | PBSS4360PAS SPICE model | SPICE model | 2024-04-05 |
PBSS4360PAS_cauer | PBSS4360PAS RC thermal cauer model | Thermal design | 2020-03-30 |
如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。
文件名称 | 标题 | 类型 | 日期 |
---|---|---|---|
PBSS4360PAS | PBSS4360PAS SPICE model | SPICE model | 2024-04-05 |
PBSS4360PAS_cauer | PBSS4360PAS RC thermal cauer model | Thermal design | 2020-03-30 |
SOT1061D | 3D model for products with SOT1061D package | Design support | 2021-07-30 |
型号 | Orderable part number | Ordering code (12NC) | 状态 | 包装 | Packing Quantity | 在线购买 |
---|---|---|---|---|---|---|
PBSS4360PAS | PBSS4360PASX | 934069625115 | Active | SOT1061D_115 | 3,000 | 订单产品 |
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The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.