双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Nr of bits Power dissipation considerations Tamb (°C) Package name
74AUP2G32DC 0.8 - 3.6 CMOS ± 1.9 7.9 70 2 ultra low -40~125 VSSOP8
74AUP2G32GN 0.8 - 3.6 CMOS ± 1.9 7.9 70 2 ultra low -40~125 XSON8
74AUP2G32GS 0.8 - 3.6 CMOS ± 1.9 7.9 70 2 ultra low -40~125 XSON8
74AUP2G32GT 0.8 - 3.6 CMOS ± 1.9 7.9 70 2 ultra low -40~125 XSON8
74AUP2G32GX 0.8 - 3.6 CMOS ± 1.9 7.9 70 2 ultra low -40~125 X2SON8

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP2G32DC 74AUP2G32DC,125
(935280713125)
Active p32 SOT765-1
VSSOP8
(SOT765-1)
SOT765-1 SOT765-1_125
74AUP2G32GN 74AUP2G32GN,115
(935292226115)
Active pG SOT1116
XSON8
(SOT1116)
SOT1116 REFLOW_BG-BD-1
SOT1116_115
74AUP2G32GS 74AUP2G32GS,115
(935292786115)
Active pG SOT1203
XSON8
(SOT1203)
SOT1203 REFLOW_BG-BD-1
SOT1203_115
74AUP2G32GT 74AUP2G32GT,115
(935280714115)
Active p32 SOT833-1
XSON8
(SOT833-1)
SOT833-1 SOT833-1_115
74AUP2G32GX 74AUP2G32GXX
(935339797115)
Active pG SOT1233-2
X2SON8
(SOT1233-2)
SOT1233-2 SOT1233-2_115

下表中的所有产品型号均已停产 。

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74AUP2G32GF 74AUP2G32GF,115
(935291491115)
Obsolete no package information
74AUP2G32GM 74AUP2G32GM,125
(935281426125)
Withdrawn / End-of-life p32 SOT902-2
XQFN8
(SOT902-2)
SOT902-2 SOT902-2_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP2G32DC 74AUP2G32DC,125 74AUP2G32DC rohs rhf rhf
74AUP2G32GN 74AUP2G32GN,115 74AUP2G32GN rohs rhf rhf
74AUP2G32GS 74AUP2G32GS,115 74AUP2G32GS rohs rhf rhf
74AUP2G32GT 74AUP2G32GT,115 74AUP2G32GT rohs rhf rhf
74AUP2G32GX 74AUP2G32GXX 74AUP2G32GX rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74AUP2G32GF 74AUP2G32GF,115 74AUP2G32GF rohs rhf rhf
74AUP2G32GM 74AUP2G32GM,125 74AUP2G32GM rohs rhf rhf
品质及可靠性免责声明

文档 (29)

文件名称 标题 类型 日期
74AUP2G32 Low-power dual 2-input OR gate Data sheet 2024-08-12
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11052 Pin FMEA for AUP family Application note 2019-01-09
001aah791 Block diagram: 74AUP2G32DC, 74AUP2G32GD, 74AUP2G32GM, 74AUP2G32GT, 74LVC2G32DC, 74LVC2G32DP, 74LVC2G32GD, 74LVC2G32GM, 74LVC2G32GT Block diagram 2009-11-04
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
SOT1233-2 3D model for products with SOT1233-2 package Design support 2021-01-28
aup2g32 aup2g32 IBIS model IBIS model 2013-04-07
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 Leaflet 2019-04-12
Nexperia_document_leaflet_Logic_X2SON_packages_062018 X2SON ultra-small 4, 5, 6 & 8-pin leadless packages Leaflet 2018-06-05
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
VSSOP8_SOT765-1_mk plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Marcom graphics 2017-01-28
XQFN8_SOT902-2_mk plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON8_SOT1203_mk plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Marcom graphics 2019-02-04
SOT765-1 plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Package information 2022-06-03
SOT902-2 plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body Package information 2020-04-21
SOT1116 plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body Package information 2022-06-02
SOT1203 plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Package information 2022-06-03
SOT833-1 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body Package information 2022-06-03
SOT1233-2 plastic thermal enhanced extremely thin small outline package; no leads;8 terminals; body 1.35 x 0.8 x 0.32 mm Package information 2022-04-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT1116 MAR_SOT1116 Topmark Top marking 2013-06-03
MAR_SOT1203 MAR_SOT1203 Topmark Top marking 2013-06-03
MAR_SOT833 MAR_SOT833 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
SOT1233-2 3D model for products with SOT1233-2 package Design support 2021-01-28
aup2g32 aup2g32 IBIS model IBIS model 2013-04-07

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