双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

参数类型

型号 Package version Package name Size (mm) Configuration Nr of lines VRWM (V) (V) Cd [typ] (pF) IPPM [max] (A) VESD (kV) (kV)
PCMF1HDMI14S WLCSP5_2-1-2 WLCSP5 0.77 x 1.17 x 0.57 Unidirectional 1 5 0.25 7 15
PCMF2HDMI14S WLCSP10_4-2-4 WLCSP10 1.57 x 1.17 x 0.57 Unidirectional 2 5 0.25 7 15
PCMF3HDMI14S WLCSP15_6-3-6 WLCSP15 2.37 x 1.17 x 0.57 Unidirectional 3 5 0.25 7 15

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PCMF1HDMI14S PCMF1HDMI14SZ
(934070709087)
Active P "with circle" WLCSP5_2-1-2
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2 暂无信息
PCMF2HDMI14S PCMF2HDMI14SZ
(934070708087)
Active P with circle WLCSP10_4-2-4
WLCSP10
(WLCSP10_4-2-4)
WLCSP10_4-2-4 WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087
PCMF3HDMI14S PCMF3HDMI14SZ
(934070711087)
Active P with circle WLCSP15_6-3-6
WLCSP15
(WLCSP15_6-3-6)
WLCSP15_6-3-6 WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PCMF1HDMI14S PCMF1HDMI14SZ PCMF1HDMI14S rohs rhf rhf
PCMF2HDMI14S PCMF2HDMI14SZ PCMF2HDMI14S rohs rhf rhf
PCMF3HDMI14S PCMF3HDMI14SZ PCMF3HDMI14S rohs rhf rhf
品质及可靠性免责声明

文档 (10)

文件名称 标题 类型 日期
PCMFXHDMI14S_SER Common-mode EMI filter for differential channels with integrated ESD protection Data sheet 2017-05-04
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP5_2-1-2_mk wafer level chip-size package; 5 bumps (2-1-2) Marcom graphics 2017-01-28
WLCSP10_4-2-4_mk wafer level chip-size package; 10 bumps (4-2-4) Marcom graphics 2017-01-28
WLCSP5_2-1-2 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP10_4-2-4 wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP15_6-3-6 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body Package information 2020-04-21

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13

Ordering, pricing & availability

样品

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