双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC2G74

Single D-type flip-flop with set and reset; positive edge trigger

The 74LVC2G74 is a single positive edge triggered D-type flip-flop with individual data (D), clock (CP), set (SD) and reset (RD) inputs, and complementary Q and Q outputs. Data at the D-input that meets the set-up and hold time requirements on the LOW-to-HIGH clock transition will be stored in the flip-flop and appear at the Q output. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.

Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times.

This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 1.65 V to 5.5 V

  • Overvoltage tolerant inputs to 5.5 V

  • High noise immunity

  • Complies with JEDEC standard:

    • JESD8-7 (1.65 V to 1.95 V)

    • JESD8-5 (2.3 V to 2.7 V)

    • JESD8-B/JESD36 (2.7 V to 3.6 V)

  • ±24 mA output drive (VCC = 3.0 V)

  • CMOS low power consumption

  • Latch-up performance exceeds 250 mA

  • Direct interface with TTL levels

  • IOFF circuitry provides partial Power-down mode operation

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC (V) Logic switching levels Output drive capability (mA) tpd (ns) fmax (MHz) Power dissipation considerations Tamb (°C) Package name
74LVC2G74DC 1.65 - 5.5 CMOS/LVTTL ± 32 3.5 280 low -40~125 VSSOP8
74LVC2G74DP 1.65 - 5.5 CMOS/LVTTL ± 32 3.5 280 low -40~125 TSSOP8
74LVC2G74GN 1.65 - 5.5 CMOS/LVTTL ± 32 3.5 280 low -40~125 XSON8
74LVC2G74GS 1.65 - 5.5 CMOS/LVTTL ± 32 3.5 280 low -40~125 XSON8
74LVC2G74GT 1.65 - 5.5 CMOS/LVTTL ± 32 3.5 280 low -40~125 XSON8

封装

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC2G74DC 74LVC2G74DC,125
(935280391125)		 Active V74 SOT765-1
VSSOP8
(SOT765-1) 		SOT765-1 SOT765-1_125
74LVC2G74DP 74LVC2G74DP,125
(935280388125)		 Active V74 SOT505-2
TSSOP8
(SOT505-2) 		SOT505-2 SOT505-2_125
74LVC2G74GN 74LVC2G74GN,115
(935292248115)		 Active Y4 SOT1116
XSON8
(SOT1116) 		SOT1116 REFLOW_BG-BD-1
SOT1116_115
74LVC2G74GS 74LVC2G74GS,115
(935292799115)		 Active Y4 SOT1203
XSON8
(SOT1203) 		SOT1203 REFLOW_BG-BD-1
SOT1203_115
74LVC2G74GT 74LVC2G74GT,115
(935280389115)		 Active V74 SOT833-1
XSON8
(SOT833-1) 		SOT833-1 SOT833-1_115

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC2G74GD 74LVC2G74GD,125
(935286754125)		 Obsolete V74 SOT996-2
XSON8
(SOT996-2) 		SOT996-2 SOT996-2_125
74LVC2G74GF 74LVC2G74GF,115
(935290521115)		 Obsolete Y4 SOT1089
XSON8
(SOT1089) 		SOT1089 REFLOW_BG-BD-1
SOT1089_115
74LVC2G74GM 74LVC2G74GM,125
(935281298125)		 Withdrawn / End-of-life V74 SOT902-2
XQFN8
(SOT902-2) 		SOT902-2 SOT902-2_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC2G74DC 74LVC2G74DC,125 74LVC2G74DC rohs rhf rhf
74LVC2G74DP 74LVC2G74DP,125 74LVC2G74DP rohs rhf rhf
74LVC2G74GN 74LVC2G74GN,115 74LVC2G74GN rohs rhf rhf
74LVC2G74GS 74LVC2G74GS,115 74LVC2G74GS rohs rhf rhf
74LVC2G74GT 74LVC2G74GT,115 74LVC2G74GT rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC2G74GD 74LVC2G74GD,125 74LVC2G74GD rohs rhf rhf
74LVC2G74GF 74LVC2G74GF,115 74LVC2G74GF rohs rhf rhf
74LVC2G74GM 74LVC2G74GM,125 74LVC2G74GM rohs rhf rhf
品质及可靠性免责声明

文档 (32)

文件名称 标题 类型 日期
74LVC2G74 Single D-type flip-flop with set and reset; positive edge trigger Data sheet 2023-08-22
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
mna421 Block diagram: 74AHC74BQ, 74AHC74D, 74AHC74PW, 74AHCT74BQ, 74AHCT74D, 74AHCT74PW, 74LVC2G74DC, 74LVC2G74DP, 74LVC2G74GD, 74LVC2G74GM, 74LVC2G74GT Block diagram 2009-11-03
Nexperia_document_guide_MiniLogic_PicoGate_201901 PicoGate leaded logic portfolio guide Brochure 2019-01-07
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT505-2 3D model for products with SOT505-2 package Design support 2019-01-18
SOT1089 3D model for products with SOT1089 package Design support 2019-10-07
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
lvc2g74 74LVC2G74 IBIS model IBIS model 2014-10-20
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
VSSOP8_SOT765-1_mk plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Marcom graphics 2017-01-28
XSON8_SOT1089_mk plastic, extremely thin small outline package; no leads; 8 terminals; 0.55 mm pitch; 1.35 mm x 1 mm x 0.5 mm body Marcom graphics 2017-01-28
XQFN8_SOT902-2_mk plastic, extremely thin quad flat package; 8 terminals; 0.55 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON8_SOT1203_mk plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Marcom graphics 2019-02-04
SOT765-1 plastic, very thin shrink small outline package; 8 leads; 0.5 mm pitch; 2 mm x 2.3 mm x 1 mm body Package information 2022-06-03
SOT505-2 plastic, thin shrink small outline package; 8 leads; 0.65 mm pitch; 3 mm x 3 mm x 1.1 mm body Package information 2022-06-03
SOT996-2 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 3 mm x 2 mm x 0.5 mm body Package information 2020-04-21
SOT1089 plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.5 mm body Package information 2022-06-03
SOT902-2 plastic, leadless extremely thin quad flat package; 8 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body Package information 2020-04-21
SOT1116 plastic, leadless extremely thin small outline package; 8 terminals; 0.3 mm pitch; 1.2 mm x 1 mm x 0.35 mm body Package information 2022-06-02
SOT1203 plastic, leadless extremely thin small outline package; 8 terminals; 0.35 mm pitch; 1.35 mm x 1 mm x 0.35 mm body Package information 2022-06-03
SOT833-1 plastic, leadless extremely thin small outline package; 8 terminals; 0.5 mm pitch; 1 mm x 1.95 mm x 0.5 mm body Package information 2022-06-03
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
MAR_SOT1089 MAR_SOT1089 Topmark Top marking 2013-06-03
MAR_SOT1116 MAR_SOT1116 Topmark Top marking 2013-06-03
MAR_SOT1203 MAR_SOT1203 Topmark Top marking 2013-06-03
MAR_SOT833 MAR_SOT833 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT765-1 3D model for products with SOT765-1 package Design support 2020-01-22
SOT505-2 3D model for products with SOT505-2 package Design support 2019-01-18
SOT1089 3D model for products with SOT1089 package Design support 2019-10-07
SOT1116 3D model for products with SOT1116 package Design support 2023-02-02
SOT1203 3D model for products with SOT1203 package Design support 2023-02-02
SOT833-1 3D model for products with SOT833-1 package Design support 2021-01-28
lvc2g74 74LVC2G74 IBIS model IBIS model 2014-10-20

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