双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

PESD3V3V4UF

Very low capacitance unidirectional quadruple ESD protection diode arrays

Very low capacitance unidirectional quadruple ElectroStatic Discharge (ESD) protection diode arrays in small Surface-Mounted Device (SMD) plastic packages designed to protect up to four signal lines from the damage caused by ESD and other transients.

此产品已停产

Features and benefits

  • ESD protection of up to four lines
  • Ultra low leakage current: IRM = 25 nA
  • Very low diode capacitance
  • ESD protection up to 12 kV
  • Max. peak pulse power: PPP = 16 W
  • IEC 61000-4-2; level 4 (ESD)
  • Low clamping voltage: VCL = 11 V
  • IEC 61000-4-5 (surge); IPP = 1.5 A

Applications

  • Computers and peripherals
  • Communication systems
  • Audio and video equipment
  • Portable electronics
  • Cellular handsets and accessories
  • Subscriber Identity Module (SIM) card protection

参数类型

型号 Package name
PESD3V3V4UF XSON6

封装

下表中的所有产品型号均已停产 。

型号 可订购的器件编号，（订购码(12NC)） 状态 标示 封装 外形图 回流焊/波峰焊 包装
PESD3V3V4UF PESD3V3V4UF,115
(934061197115)		 Obsolete SOT886
XSON6
(SOT886) 		SOT886 REFLOW_BG-BD-1
SOT886_115

环境信息

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PESD3V3V4UF PESD3V3V4UF,115 PESD3V3V4UF rohs rhf rhf
品质及可靠性免责声明

Series

文档 (11)

文件名称 标题 类型 日期
PESDXV4UF_G_W Very low capacitance unidirectional quadruple ESD protection diode arrays Data sheet 2022-05-03
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PESD3V3V4UF PESD3V3V4UF SPICE model SPICE model 2012-07-22
PESD3V3V4UF PESD3V3V4UF SPICE model SPICE model 2024-07-08
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
PESD3V3V4UF PESD3V3V4UF SPICE model SPICE model 2012-07-22
PESD3V3V4UF PESD3V3V4UF SPICE model SPICE model 2024-07-08
SOT886 3D model for products with SOT886 package Design support 2019-10-03

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

交互式数据手册