双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

74LVC1T45; 74LVCH1T45

Dual supply translating transceiver; 3-state

The 74LVC1T45; 74LVCH1T45 are single bit, dual supply transceivers with 3-state outputs that enable bidirectional level translation. They feature two 1-bit input-output ports (A and B), a direction control input (DIR) and dual supply pins (VCC(A) and VCC(B)). Both VCC(A) and VCC(B) can be supplied at any voltage between 1.2 V and 5.5 V making the device suitable for translating between any of the low voltage nodes (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V and 5.0 V). Pins A and DIR are referenced to VCC(A) and pin B is referenced to VCC(B). A HIGH on DIR allows transmission from A to B and a LOW on DIR allows transmission from B to A.

The devices are fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing any damaging backflow current through the device when it is powered down. In suspend mode when either VCC(A) or VCC(B) are at GND level, both A port and B port are in the high-impedance OFF-state.

Active bus hold circuitry in the 74LVCH1T45 holds unused or floating data inputs at a valid logic level.

Features and benefits

  • Wide supply voltage range:

    • VCC(A): 1.2 V to 5.5 V

    • VCC(B): 1.2 V to 5.5 V

  • High noise immunity

  • Maximum data rates:

    • 420 Mbps (3.3 V to 5.0 V translation)

    • 210 Mbps (translate to 3.3 V))

    • 140 Mbps (translate to 2.5 V)

    • 75 Mbps (translate to 1.8 V)

    • 60 Mbps (translate to 1.5 V)

  • Suspend mode

  • Latch-up performance exceeds 100 mA per JESD 78 Class II

  • ±24 mA output drive (VCC = 3.0 V)

  • Inputs accept voltages up to 5.5 V

  • Low power consumption: 16 μA maximum ICC

  • IOFF circuitry provides partial Power-down mode operation

  • Complies with JEDEC standards:

    • JESD8-7 (1.2 V to 1.95 V)

    • JESD8-5 (1.8 V to 2.7 V)

    • JESD8C (2.7 V to 3.6 V)

    • JESD36 (4.5 V to 5.5 V)

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Multiple package options

  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

参数类型

型号 VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name
74LVC1T45GM 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 XSON6
74LVC1T45GM-Q100 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 XSON6
74LVC1T45GN 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 XSON6
74LVC1T45GS 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 XSON6
74LVC1T45GW 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 TSSOP6
74LVC1T45GW-Q100 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 TSSOP6
74LVCH1T45GM 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 XSON6
74LVCH1T45GN 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 XSON6
74LVCH1T45GS 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 XSON6
74LVCH1T45GW 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 TSSOP6
74LVCH1T45GW-Q100 1.2 - 5.5 1.2 - 5.5 CMOS/LVTTL ± 24 2.5 1 low -40~125 TSSOP6

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
74LVC1T45GM 74LVC1T45GM,115
(935284752115)
Active V5 SOT886
XSON6
(SOT886)
SOT886 REFLOW_BG-BD-1
SOT886_115
74LVC1T45GM,132
(935284752132)
Active V5 SOT886_132
74LVC1T45GM-Q100 74LVC1T45GM-Q100X
(935690846115)
Active V5 SOT886
XSON6
(SOT886)
SOT886 REFLOW_BG-BD-1
SOT886_115
74LVC1T45GN 74LVC1T45GN,132
(935291797132)
Active V5 SOT1115
XSON6
(SOT1115)
SOT1115 REFLOW_BG-BD-1
SOT1115_132
74LVC1T45GS 74LVC1T45GS,132
(935292925132)
Active V5 SOT1202
XSON6
(SOT1202)
SOT1202 REFLOW_BG-BD-1
SOT1202_132
74LVC1T45GW 74LVC1T45GW,125
(935284751125)
Active V5 SOT363-2
TSSOP6
(SOT363-2)
SOT363-2 SOT363-2_125
74LVC1T45GW-Q100 74LVC1T45GW-Q100H
(935300935125)
Active V5 SOT363-2
TSSOP6
(SOT363-2)
SOT363-2 SOT363-2_125
74LVCH1T45GM 74LVCH1T45GM,115
(935284755115)
Active X5 SOT886
XSON6
(SOT886)
SOT886 REFLOW_BG-BD-1
SOT886_115
74LVCH1T45GM,132
(935284755132)
Active X5 SOT886_132
74LVCH1T45GN 74LVCH1T45GN,132
(935291806132)
Active X5 SOT1115
XSON6
(SOT1115)
SOT1115 REFLOW_BG-BD-1
SOT1115_132
74LVCH1T45GS 74LVCH1T45GS,132
(935292934132)
Active X5 SOT1202
XSON6
(SOT1202)
SOT1202 REFLOW_BG-BD-1
SOT1202_132
74LVCH1T45GW 74LVCH1T45GW,125
(935284754125)
Active X5 SOT363-2
TSSOP6
(SOT363-2)
SOT363-2 SOT363-2_125
74LVCH1T45GW-Q100 74LVCH1T45GW-Q100H
(935300936125)
Active X5 SOT363-2
TSSOP6
(SOT363-2)
SOT363-2 SOT363-2_125

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
74LVC1T45GM 74LVC1T45GM,115 74LVC1T45GM rohs rhf rhf
74LVC1T45GM 74LVC1T45GM,132 74LVC1T45GM rohs rhf rhf
74LVC1T45GM-Q100 74LVC1T45GM-Q100X 74LVC1T45GM-Q100 rohs rhf rhf
74LVC1T45GN 74LVC1T45GN,132 74LVC1T45GN rohs rhf rhf
74LVC1T45GS 74LVC1T45GS,132 74LVC1T45GS rohs rhf rhf
74LVC1T45GW 74LVC1T45GW,125 74LVC1T45GW rohs rhf rhf
74LVC1T45GW-Q100 74LVC1T45GW-Q100H 74LVC1T45GW-Q100 rohs rhf rhf
74LVCH1T45GM 74LVCH1T45GM,115 74LVCH1T45GM rohs rhf rhf
74LVCH1T45GM 74LVCH1T45GM,132 74LVCH1T45GM rohs rhf rhf
74LVCH1T45GN 74LVCH1T45GN,132 74LVCH1T45GN rohs rhf rhf
74LVCH1T45GS 74LVCH1T45GS,132 74LVCH1T45GS rohs rhf rhf
74LVCH1T45GW 74LVCH1T45GW,125 74LVCH1T45GW rohs rhf rhf
74LVCH1T45GW-Q100 74LVCH1T45GW-Q100H 74LVCH1T45GW-Q100 rohs rhf rhf
品质及可靠性免责声明

文档 (24)

文件名称 标题 类型 日期
74LVC_LVCH1T45 Dual supply translating transceiver; 3-state Data sheet 2023-08-04
AN10161 PicoGate Logic footprints Application note 2002-10-29
AN11009 Pin FMEA for LVC family Application note 2019-01-09
001aag885 Block diagram: 74LVC1T45GF, 74LVC1T45GM, 74LVC1T45GW, 74LVCH1T45GF, 74LVCH1T45GM, 74LVCH1T45GW Block diagram 2009-11-04
Nexperia_document_guide_Logic_translators Nexperia Logic Translators Brochure 2021-04-12
Nexperia_document_guide_MiniLogic_MicroPak_201808 MicroPak leadless logic portfolio guide Brochure 2018-09-03
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
lvc1t45 lvc1t45 IBIS model IBIS model 2013-04-08
lvch1t45 lvch1t45 IBIS model IBIS model 2013-04-09
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN1410-6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT886_mk plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Marcom graphics 2017-01-28
XSON6_SOT1115_mk plastic, extremely thin small outline package; 6 terminals; 0.55 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Marcom graphics 2017-01-28
SOT886 plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body Package information 2022-06-01
SOT1115 plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body Package information 2022-05-27
SOT1202 plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body Package information 2022-06-01
SOT363-2 plastic thin shrink small outline package; 6 leads; body width 1.25 mm Package information 2022-11-21
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
MAR_SOT886 MAR_SOT886 Topmark Top marking 2013-06-03
MAR_SOT1115 MAR_SOT1115 Topmark Top marking 2013-06-03
MAR_SOT1202 MAR_SOT1202 Topmark Top marking 2013-06-03

支持

如果您需要设计/技术支持,请告知我们并填写 应答表 我们会尽快回复您。

模型

文件名称 标题 类型 日期
SOT886 3D model for products with SOT886 package Design support 2019-10-03
SOT1115 3D model for products with SOT1115 package Design support 2023-02-02
SOT1202 3D model for products with SOT1202 package Design support 2023-02-02
SOT363-2 3D model for products with SOT363-2 package Design support 2023-02-02
lvc1t45 lvc1t45 IBIS model IBIS model 2013-04-08
lvch1t45 lvch1t45 IBIS model IBIS model 2013-04-09

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