双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

PESDxUSB3B

ESD protection for differential data lines

ElectroStatic Discharge (ESD) protection for one, two and three differential channels.

The devices are footprint compatible to PCMFxUSB3B/C common mode filters with ESD protection.

Diodes provide protection to downstream components from ESD voltages up to ±20 kV on each signal line.

Table 1. Product overview

Type Number

Number of channels

Package name

PESD1USB3B/C

1

WLCSP5

PESD2USB3B/C

2

WLCSP10

PESD3USB3B/C

3

WLCSP15

Features and benefits

  • Allows switching between PCMFxUSB3B/C common mode filters with ESD protection and PESDxUSB3B/C ESD protection in the same footprint

  • TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive Systems on Chips (SoCs)

  • ESD protection for one, two and three differential channels up to ±20 kV contact discharge according to IEC 61000-4-2

  • Industry-standard WLCSP5, 10 and 15 packages for smallest footprint

  • Bidirectional for audio line option

Applications

  • Smartphone, cellular and cordless phone

  • USB3.2, USB2.0, HDMI2.0, HDMI1.4

  • General-purpose downstream ESD protection for differential data lines

  • Tablet PC and Mobile Internet Device (MID)

  • MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)

参数类型

型号 Package version Package name Size (mm) Configuration Nr of lines VRWM (V) (V) Cd [typ] (pF) IPPM [max] (A) VESD (kV) (kV)
PESD1USB3B WLCSP5_2-1-2 WLCSP5 0.77 x 1.17 x 0.57 Bidirectional 2 4 0.29 9.5 20
PESD2USB3B WLCSP10_4-2-4 WLCSP10 1.57 x 1.17 x 0.57 Bidirectional 4 4 0.29 9.5 20
PESD3USB3B WLCSP15_6-3-6 WLCSP15 2.37 x 1.17 x 0.57 Bidirectional 6 4 0.29 9.5 20

封装

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PESD1USB3B PESD1USB3B/CZ
(934660293087)
Active WLCSP5_2-1-2
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2 暂无信息
PESD2USB3B PESD2USB3B/CZ
(934660294087)
Active WLCSP10_4-2-4
WLCSP10
(WLCSP10_4-2-4)
WLCSP10_4-2-4 WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087
PESD3USB3B PESD3USB3B/CZ
(934660295087)
Active WLCSP15_6-3-6
WLCSP15
(WLCSP15_6-3-6)
WLCSP15_6-3-6 WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087

下表中的所有产品型号均已停产 。

型号 可订购的器件编号,(订购码(12NC)) 状态 标示 封装 外形图 回流焊/波峰焊 包装
PESD1USB3B PESD1USB3B/CX
(934660293115)
Withdrawn / End-of-life WLCSP5_2-1-2
WLCSP5
(WLCSP5_2-1-2)
WLCSP5_2-1-2 暂无信息

环境信息

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PESD1USB3B PESD1USB3B/CZ PESD1USB3B rohs rhf rhf
PESD2USB3B PESD2USB3B/CZ PESD2USB3B rohs rhf rhf
PESD3USB3B PESD3USB3B/CZ PESD3USB3B rohs rhf rhf

下表中的所有产品型号均已停产 。

型号 可订购的器件编号 化学成分 RoHS RHF指示符
PESD1USB3B PESD1USB3B/CX PESD1USB3B rohs rhf rhf
品质及可靠性免责声明

文档 (10)

文件名称 标题 类型 日期
PESDXUSB3B_C_SER ESD protection for differential data lines Data sheet 2019-01-29
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
WLCSP5_2-1-2_mk wafer level chip-size package; 5 bumps (2-1-2) Marcom graphics 2017-01-28
WLCSP10_4-2-4_mk wafer level chip-size package; 10 bumps (4-2-4) Marcom graphics 2017-01-28
WLCSP5_2-1-2 wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP10_4-2-4 wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body Package information 2020-04-21
WLCSP15_6-3-6 wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body Package information 2020-04-21

支持

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模型

文件名称 标题 类型 日期
WLCSP5_2-1-2 3D model for products with WLCSP5_2-1-2 package Design support 2023-03-13
WLCSP10_4-2-4 3D model for products with WLCSP10_4-2-4 package Design support 2023-03-13
WLCSP15_6-3-6 3D model for products with WLCSP15_6-3-6 package Design support 2023-03-13

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