PESDxUSB3S
ESD protection for differential data lines
The devices are ElectroStatic Discharge (ESD) protection devices for one, two or three differential channels.
The PESDxUSB3S is footprint compatible to PCMFxUSB3S.
The devices provide protection to downstream components from ESD voltages up to ±15 kV on each signal line.
Type number | Number of channels | Package Name |
|---|---|---|
PESD1USB3S | 1 | WLCSP5 |
PESD2USB3S | 2 | WLCSP10 |
PESD3USB3S | 3 | WLCSP15 |
Features and benefits
Allows replacement between PCMFxUSB3S common-mode filters with ESD protection and PESDxUSB3S ESD protection in the same footprint
TrEOS protection process for very high system-level ESD robustness: superior protection of sensitive SoCs
ESD protection for one, two and three differential channels up to ±15 kV contact discharge according to IEC 61000-4-2
Industry-standard WLCSP5, 10 and 15 packages for smallest footprint
Applications
Smartphone, cellular and cordless phone
USB3.1, USB2.0, HDMI2.0, HDMI1.4
General-purpose downstream ESD protection
Tablet PC and Mobile Internet Device (MID)
MIPI D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI)
参数类型
| 型号 | Package version | Package name | Size (mm) | Configuration | Nr of lines | VRWM (V) (V) | Cd [typ] (pF) | IPPM [max] (A) | VESD (kV) (kV) |
|---|---|---|---|---|---|---|---|---|---|
| PESD1USB3S | WLCSP5_2-1-2 | WLCSP5 | 0.77 x 1.17 x 0.57 | Unidirectional | 2 | 5 | 0.45 | 8 | 15 |
| PESD2USB3S | WLCSP10_4-2-4 | WLCSP10 | 1.57 x 1.17 x 0.57 | Unidirectional | 4 | - | 0.45 | 8 | 15 |
| PESD3USB3S | WLCSP15_6-3-6 | WLCSP15 | 2.37 x 1.17 x 0.57 | Unidirectional | 6 | 5 | 0.45 | 8 | 15 |
封装
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PESD1USB3S | PESD1USB3S/CZ (934660289087) |
Active |
WLCSP5 (WLCSP5_2-1-2) |
WLCSP5_2-1-2 | 暂无信息 | ||
| PESD1USB3SZ (934069683087) |
Active | 暂无信息 | |||||
| PESD2USB3S | PESD2USB3S/CZ (934660291087) |
Active |
WLCSP10 (WLCSP10_4-2-4) |
WLCSP10_4-2-4 | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | ||
| PESD2USB3SZ (934069684087) |
Active | WLCSP10_PCMF_PESD2USB3X_PCMF2HDMI2X_087 | |||||
| PESD3USB3S | PESD3USB3S/CZ (934660292087) |
Active |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 | ||
| PESD3USB3SZ (934069685087) |
Active | WLCSP15_PCMF_PESD3USB3X_PCMF3HDMI2X_087 |
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号，（订购码(12NC)） | 状态 | 标示 | 封装 | 外形图 | 回流焊/波峰焊 | 包装 |
|---|---|---|---|---|---|---|---|
| PESD3USB3S | PESD3USB3S/CX (934660292115) |
Withdrawn / End-of-life |
WLCSP15 (WLCSP15_6-3-6) |
WLCSP15_6-3-6 | 暂无信息 |
环境信息
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD1USB3S | PESD1USB3S/CZ | PESD1USB3S |
|
|
| PESD1USB3S | PESD1USB3SZ | PESD1USB3S |
|
|
| PESD2USB3S | PESD2USB3S/CZ | PESD2USB3S |
|
|
| PESD2USB3S | PESD2USB3SZ | PESD2USB3S |
|
|
| PESD3USB3S | PESD3USB3S/CZ | PESD3USB3S |
|
|
| PESD3USB3S | PESD3USB3SZ | PESD3USB3S |
|
|
下表中的所有产品型号均已停产 。
| 型号 | 可订购的器件编号 | 化学成分 | RoHS | RHF指示符 |
|---|---|---|---|---|
| PESD3USB3S | PESD3USB3S/CX | PESD3USB3S |
|
|
文档 (10)
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| PESDXUSB3S_SER | ESD protection for differential data lines | Data sheet | 2019-01-30 |
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| WLCSP5_2-1-2_mk | wafer level chip-size package; 5 bumps (2-1-2) | Marcom graphics | 2017-01-28 |
| WLCSP10_4-2-4_mk | wafer level chip-size package; 10 bumps (4-2-4) | Marcom graphics | 2017-01-28 |
| WLCSP5_2-1-2 | wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP10_4-2-4 | wafer level chip-size package; 10 bumps (4-2-4); 0.4 mm pitch; 1.57 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
| WLCSP15_6-3-6 | wafer level chip-size package; 15 bumps (6-3-6); 0.4 mm pitch; 2.37 x 1.17 x 0.57 mm body | Package information | 2020-04-21 |
支持
如果您需要设计/技术支持，请告知我们并填写 应答表 我们会尽快回复您。
模型
| 文件名称 | 标题 | 类型 | 日期 |
|---|---|---|---|
| WLCSP5_2-1-2 | 3D model for products with WLCSP5_2-1-2 package | Design support | 2023-03-13 |
| WLCSP10_4-2-4 | 3D model for products with WLCSP10_4-2-4 package | Design support | 2023-03-13 |
| WLCSP15_6-3-6 | 3D model for products with WLCSP15_6-3-6 package | Design support | 2023-03-13 |
Ordering, pricing & availability
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