Nexperia now offers automotive planar Schottky diodes in space-saving CFP2-HP packaging
April 29, 2025Nijmegen -- Providing superior heat dissipation while still maintaining small footprint size
Nexperia today announced that it is now offering a portfolio of 16 new low VF optimized planar Schottky diodes in CFP2-HP packaging. The portfolio includes eight industrial (e.g. PMEG6010EXD), as well as eight AEC-Q101 qualified (e.g. PMEG4010EXD-Q) products. This release supports the growing trend for manufacturers to replace devices in SMA/B/C type packaging with smaller footprint CFP-packaged devices, especially in automotive applications. These diodes are suitable for use in, for example, DC-DC conversion, freewheeling, reverse polarity protection and OR-ing applications.
For maximum design flexibility, this portfolio extension offers reverse voltages VR(max) ranging from 20 V to 60 V and forward currents IF(average) of 1 A and 2 A. The exposed heatsink of the CFP2-HP enables the highest level of heat dissipation (Ptot) at a small package footprint. The CFP2-HP package dimensions are 2.65 mm x 1.3 mm x 0.68 mm (inc. leads).
"As the industry transitions to multi-layer PCBs, a trend driven by the increasing popularity of high-performance microcontrollers, packaging becomes a crucial part of the thermal system. Smaller packages like CFP, which offer more efficient heat dissipation, are a core part of Nexperia’s commitment to actively contribute to this shift," says Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. "Modern CFP packaging technology, designed for multilayer PCBs, offers equal electrical performance on a smaller footprint, reducing part and system costs. With substantial investments in capacity expansion, we are poised to meet the increasing demand for CFP-packaged products. They are essential for future-proofing automotive and industrial applications against the rising demands and ensuring competitiveness in the market.”
Utilizing the copper clip design, these packages meet the challenging demands of efficient and space-saving designs. Today, CFP packaging is used by different power diode technologies such as Nexperia’s Schottky and Recovery Rectifier Diodes and will also be extended to bipolar transistors soon. It offers significant product diversity. This further solidifies Nexperia’s position as a leader in packaging innovation, offering customers the widest range of device options from a semiconductor manufacturer with a trusted supply chain.
A low IR optimized portfolio of planar Schottky diodes for automotive and industrial applications will be released in May. To learn more about Nexperia’s planar Schottky diodes in CFP2-HP packaging visit: www.nexperia.com/cfp
About Nexperia
Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 12,500 employees across Europe, Asia, and the United States. As a leading expert in the development and production of essential semiconductors, Nexperia’s components enable the basic functionality of virtually every commercial electronic design in the world – from automotive and industrial to mobile and consumer applications.
The company serves a global customer base, shipping more than 100 billion products annually. These products are recognized as benchmarks in efficiency – in process, size, power, and performance. Nexperia's commitment to innovation, efficiency, sustainability, and stringent industry requirements is evident in its extensive IP portfolio, its expanding product range, and its certification to IATF 16949, ISO 9001, ISO 14001 and ISO 45001 standards.
For press information, please contact:
Nexperia
Anne Proch
Tel: +49 160 916 884 18
Email: anne.proch@nexperia.com
Publitek
Lucy Sorton
Tel: +44 07966 301949
E-mail: lucy.sorton@publitek.com