双极性晶体管

二极管

ESD保护、TVS、滤波和信号调节ESD保护

MOSFET

氮化镓场效应晶体管(GaN FET)

绝缘栅双极晶体管(IGBTs)

模拟和逻辑IC

汽车应用认证产品(AEC-Q100/Q101)

PBSS5112PAP

120 V, 1 A PNP/PNP low VCEsat (BISS) transistor

PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a leadless medium power DFN2020-6 (SOT1118) Surface-Mounted Device (SMD) plastic package. NPN/PNP complement: PBSS4112PANP. NPN/NPN complement: PBSS4112PAN.

This product has been discontinued

Features and benefits

  • Very low collector-emitter saturation voltage VCEsat

  • High collector current capability IC and ICM

  • High collector current gain hFE at high IC

  • Reduced Printed-Circuit Board (PCB) requirements

  • High energy efficiency due to less heat generation

  • AEC-Q101 qualified

Applications

  • Load switch

  • Battery-driven devices

  • Power management

  • Charging circuits

  • Power switches (e.g. motors, fans)

Parametrics

Type number Package version Package name Size (mm) Product status channel type (e) Nr of transistors Ptot [max] (mW) VCEO [max] (V) IC [max] (A) VCEsat [max] (PNP) (mV) RCEsat@IC [max] (mΩ) hFE [min] fT [typ] (MHz)
PBSS5112PAP SOT1118 DFN2020-6 2 x 2 x 0.65 End of life PNP 2 1040.0 -120.0 -1.0 -480.0 440.0 190.0 100.0

Package

All type numbers in the table below are discontinued.

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
PBSS5112PAP PBSS5112PAP,115
(934066894115)		 Discontinued / End-of-life 2S SOT1118
DFN2020-6
(SOT1118) 		SOT1118 REFLOW_BG-BD-1
SOT1118_115

Environmental information

All type numbers in the table below are discontinued.

Type number Orderable part number Chemical content RoHS RHF-indicator
PBSS5112PAP PBSS5112PAP,115 PBSS5112PAP rohs rhf rhf
Quality and reliability disclaimer

Series

Documentation (8)

File name Title Type Date
PBSS5112PAP 120 V, 1 A PNP/PNP low VCEsat (BISS) transistor Data sheet 2017-05-29
SOT1118 3D model for products with SOT1118 package Design support 2019-10-07
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DFN2020-6_SOT1118_mk plastic, thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body Marcom graphics 2017-01-28
SOT1118 plastic, leadless thermal enhanced ultra thin small outline package; no leads; 6 terminals; 0.65 mm pitch; 2 mm x 2 mm x 0.65 mm body Package information 2022-06-02
PBSS5112PAP_Nexperia_Product_Reliability PBSS5112PAP Nexperia Product Reliability Quality document 2024-04-23
REFLOW_BG-BD-1 Reflow soldering profile Reflow soldering 2021-04-06
PBSS5112PAP PBSS5112PAP SPICE model SPICE model 2024-08-27

Support

If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.

Models

File name Title Type Date
PBSS5112PAP PBSS5112PAP SPICE model SPICE model 2024-08-27
SOT1118 3D model for products with SOT1118 package Design support 2019-10-07

How does it work?

The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.

Interactive datasheet