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Click here for more informationPMCM950ENE
60 V, N-channel Trench MOSFET
N-channel enhancement mode Field-Effect Transistor (FET) in a 9 bumps Wafer Level Chip-Size Package (WLCSP) using Trench MOSFET technology.
Features and benefits
Low threshold voltage
Ultra small package: 1.48 × 1.48 × 0.35 mm
Trench MOSFET technology
ElectroStatic Discharge (ESD) protection > 2 kV HBM
Applications
High-speed line driver
Low-side load switch
Switching circuits
Parametrics
| Type number | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | VGS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V; @25 C (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Release date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PMCM950ENE | WLCSP9_3X3 | WLCSP9 | End of life | N | 1 | 60 | 20 | 41 | 47 | 150 | 6.1 | 5.9 | 30 | 0.78 | 1.2 | N | 1160 | 71 | 2019-05-13 |
Package
All type numbers in the table below are discontinued.
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| PMCM950ENE | PMCM950ENEZ (934660311023) |
Discontinued / End-of-life |
WLCSP9 (WLCSP9_3X3) |
WLCSP9_3X3 | Not available |
Environmental information
All type numbers in the table below are discontinued.
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| PMCM950ENE | PMCM950ENEZ | PMCM950ENE |
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Documentation (5)
| File name | Title | Type | Date |
|---|---|---|---|
| PMCM950ENE | 60 V, N-channel Trench MOSFET | Data sheet | 2019-05-13 |
| WLCSP9_3X3 | 3D model for products with WLCSP9_3X3 package | Design support | 2023-03-13 |
| nexperia_document_leaflet_SsMOS_for_mobile_2022 | High volume small-signal MOSFETs for mobile and portables, in WLCSP and leadless DFN packages | Leaflet | 2022-07-04 |
| WLCSP9_3X3 | WLCSP9: wafer level chip-size package; 9 bumps (3 x 3) | Package information | 2020-04-21 |
| PMCM950ENE | PMCM950ENE SPICE model | SPICE model | 2020-02-19 |
Support
If you are in need of design/technical support, let us know and fill in the answer form we'll get back to you shortly.
Models
| File name | Title | Type | Date |
|---|---|---|---|
| PMCM950ENE | PMCM950ENE SPICE model | SPICE model | 2020-02-19 |
| WLCSP9_3X3 | 3D model for products with WLCSP9_3X3 package | Design support | 2023-03-13 |
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.
PMCM950ENE
60 V, N-channel Trench MOSFET
Buy from Nexperia
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